Polishing process of indium phosphide substrate

Abstract

The invention discloses a polishing process of an indium phosphide substrate, belongs to the technical field of indium phosphide polishing, and is realized based on an indium phosphide polishing device. The polishing device comprises an electrolytic bath, an anode disc supporting rod positioned in the center of the bottom of the electrolytic bath through an anode lifting mechanism, an anode disc hinged to the upper end of the anode disc supporting rod, a cathode disc supporting rod positioned above the anode disc through a cathode lifting mechanism, a cathode disc arranged at the lower end of the cathode disc supporting rod, a graphite electrode plate arranged on the anode disc through a connecting mechanism, a swimming star wheel set arranged on the upper end face of the graphite electrode plate through a middle driving mechanism, an anode rotation driving mechanism connected with the middle driving mechanism, a cathode rotation driving mechanism connected with the cathode disc supporting rod and a polishing direct-current power supply connected with contacts of the anode disc supporting rod and the cathode disc supporting rod through wires. The structure and the process of the device are improved, and the advantages of electrochemical polishing and mechanical polishing technologies are combined, so that the requirement for the environment in the polishing process of indium phosphide is greatly reduced, and the polishing effect is ideal.

Description

technical field [0001] The invention belongs to the technical field of indium phosphide polishing, and in particular relates to a polishing process of an indium phosphide substrate. Background technique [0002] InP material is an important III-V compound semiconductor material, which has the characteristics of high electron mobility and large saturation drift rate. It is the main basic material for realizing millimeter-wave circuits and terahertz electronic devices. InP-based devices have high-frequency, Low noise, high efficiency, anti-irradiation and other characteristics, it is the first choice for frequency bands above 100GHz, has excellent performance in W-band and higher frequency millimeter wave circuits, and is used in optical fiber communication, mobile communication, medical imaging, terahertz communication and other fields widely. [0003] The polishing technology of InP is an important index to measure its preparation level, and the flatness and low roughness o...

AI Technical Summary

Problems solved by technology

Usually, the polishing of InP single crystal substrates mainly adopts electrochemical polishing technology or mechanical polishing technology, but the polishing effect of the two is not stable, and the polishing uniformity is not ideal, especially the chemical composition of the polishing liquid in the electrochemical polishing technology is relatively low. Complicated and demanding on the environment

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