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A kind of high Tg thermosetting resin composition and its preparation method and application

A resin composition, thermosetting technology, applied in the direction of epoxy resin glue, non-polymer adhesive additives, adhesive types, etc., can solve the problems of large dielectric loss, low Tg value, harsh process conditions, etc., to achieve Effects of low dielectric constant, low expansion coefficient, and high peel strength

Active Publication Date: 2022-06-07
林州致远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

IC packaging technology requires the substrate of the package to have high heat resistance, moisture resistance and rigidity (Low CTE), and at the same time must have a small loss for signal transmission (that is, low dielectric loss); however, the traditional FR-4 material The thermosetting material used has defects such as high expansion coefficient and high dielectric loss, so it cannot meet the above requirements
[0003] Bismaleimide resin has excellent characteristics such as low thermal expansion coefficient, low dielectric loss, and high glass transition temperature. Although it can meet the above requirements, it has problems such as poor solubility, harsh process conditions, high crosslinking density, and high brittleness. Seriously affect its performance
At the same time, the composite resin system of bismaleimide and cyanate ester has problems such as that the cyanate ester and bismaleimide cannot be well copolymerized, resulting in low heat resistance of the cured resin and poor overall performance of the resin. good
In addition, the above-mentioned existing resins have low Tg values, which cannot meet the corresponding application requirements.

Method used

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  • A kind of high Tg thermosetting resin composition and its preparation method and application

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Preparation of low dielectric phenolic cyanate resin

[0031] Add 80 parts of cyclohexanone to a four-necked flask with a stirrer and a thermometer, then add 208 parts of styrene and 114 parts of allyl glycidyl ether, start stirring; add 0.03 part of peroxide when the temperature rises to about 85°C tert-butyl benzoate and 0.005 part of hydroquinone, and then continue to slowly heat up to 95° C., keep the temperature for 3 hours, and obtain the first resin.

[0032] After mixing 100 parts of the first resin, 22 parts of bisphenol A cyanate, 28 parts of novolac cyanate and 0.02 part of cobalt acetylacetonate (as a catalyst), react at 180 ° C for 2 hours to obtain low dielectric phenolic cyanate Ester resin.

[0033] 2. Preparation of glue for high Tg copper clad laminate

[0034] The composition of the glue for the high Tg copper clad laminate of the present embodiment is as follows:

[0035] Tetramethylbiphenyl epoxy resin: 10 parts

[0036] Bisphenol A cyanate r...

Embodiment 2

[0056] 1. Preparation of low dielectric phenolic cyanate resin

[0057] Add 85 parts of cyclohexanone to a four-necked flask with a stirrer and a thermometer, then add 215 parts of styrene and 110 parts of allyl glycidyl ether, and start stirring; when the temperature is raised to about 80 °C, add 0.02 parts of peroxide tert-butyl benzoate and 0.006 part of hydroquinone were then continued to slowly heat up to 90° C., and the reaction was kept for 3.5 hours to obtain the first resin.

[0058] After mixing 90 parts of the first resin, 25 parts of bisphenol A cyanate, 30 parts of novolac cyanate and 0.01 part of cobalt acetylacetonate, react at 190° C. for 1.5 hours to obtain a low dielectric phenolic cyanate resin.

[0059] 2. Preparation of glue for high Tg copper clad laminate

[0060] The composition of the glue for the high Tg copper clad laminate of the present embodiment is as follows:

[0061] Tetramethylbiphenyl epoxy resin: 10 parts

[0062] Bisphenol A cyanate resi...

Embodiment 3

[0076] 1. Preparation of low dielectric phenolic cyanate resin

[0077] Add 75 parts of cyclohexanone to a four-necked flask with a stirrer and a thermometer, then add 200 parts of styrene and 120 parts of allyl glycidyl ether, and start stirring; when the temperature rises to about 90 °C, add 0.04 parts of peroxide tert-butyl benzoate and 0.004 part of hydroquinone, then continue to slowly heat up to 100° C., keep the temperature for 2.5 hours, and obtain the first resin.

[0078] After mixing 110 parts of the first resin, 20 parts of bisphenol A cyanate, 25 parts of novolac cyanate and 0.03 part of cobalt acetylacetonate, react at 185° C. for 2.5 hours to obtain a low dielectric phenolic cyanate resin.

[0079] 2. Preparation of glue for high Tg copper clad laminate

[0080] The composition of the glue for the high Tg copper clad laminate of the present embodiment is as follows:

[0081] Tetramethyl biphenyl epoxy resin: 5 parts

[0082] Bisphenol A cyanate resin: 20 part...

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Abstract

The invention provides a high Tg thermosetting resin composition and its preparation method and application. The high Tg thermosetting resin composition of the present invention comprises the following components by weight: 5-10 parts of biphenyl type epoxy resin, 10-20 parts of bisphenol A type cyanate resin, 10-20 parts of novolak type cyanate resin 30 parts, 10-30 parts of low dielectric phenolic cyanate resin and 12-25 parts of bismaleimide resin. The Tg of the thermosetting resin composition of the present invention is as high as 280°C, and has the advantages of good heat resistance, high peel strength, low expansion coefficient, low dielectric constant, and low dielectric loss, and can be well applied to printed circuit boards for encapsulating carrier boards middle.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a high Tg thermosetting resin composition and a preparation method and application thereof. Background technique [0002] With the gradual development of electronic products in the direction of light, thin and small, high-speed and high-frequency, products have put forward more stringent requirements for the innovation of the upstream CCL industry in terms of heat dissipation, precision layout, and packaging design. IC packaging technology requires the packaged substrate to have high heat resistance, moisture resistance and rigidity (Low CTE), and at the same time, it must have little loss (ie low dielectric loss) for signal transmission; however, traditional FR-4 materials The thermosetting materials used have defects such as high expansion coefficient and large dielectric loss, which cannot meet the above requirements. [0003] Bismaleimide resin has excellent ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J179/04C09J163/00C09J179/08C09J11/04C09J11/06H05K1/03
CPCC09J179/04C09J11/04C09J11/06H05K1/036C08L2205/025C08L2205/035C08L2201/08C08L2203/206C08L79/04C08L63/00C08L79/085C08K5/5313C08K3/34C08K5/521C08K3/36C08K5/523
Inventor 谢长乐高源中李广元李永平钟英雄付艺伟焦志慧
Owner 林州致远电子科技有限公司