Network type aluminum substrate multi-heat sink plate type radiator capable of being used for electronic products

Abstract

The invention relates to the technical field of radiators, in particular to a network type aluminum substrate multi-heat sink plate type radiator capable of being used for electronic products. The network type aluminum substrate multi-heat sink plate type radiator capable of being used for the electronic products comprises: an evaporation area comprising a plurality of evaporation tanks; a condensation area comprising a plurality of condensation tanks; a plurality of pulsating tube bundles; and a plurality of return tubes, wherein the pulsating tube bundles and the return tubes communicate between each evaporation tank and each condensation tank. The aluminum substrate multi-heat sink plate type radiator can be provided with four large heat dissipation areas during double condensation and double evaporation, so that large-area heat dissipation is achieved, and phase-changing heat dissipation is achieved through aluminum-based materials. Four areas are arranged and used for achieving different functions; different design principles are adopted in all the areas; and the purpose of more excellent heat and mass transfer is achieved. The positions and the number of heat sinks can be adjusted, then personalized customization is achieved, so that the better effect is achieved, the better heat dissipation effect is achieved compared with a traditional heat dissipation pipe, and meanwhile cost is low.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to a network type aluminum substrate multi-heat sink plate heat sink that can be used for electronic products. Background technique [0002] There are many kinds of heat pipes in the prior art, such as type A heat pipes. The heat pipe is a heat transfer element with high thermal conductivity. It transfers heat through the evaporation and condensation of the working fluid in the fully enclosed vacuum tube shell. It has a series of advantages such as thermal conductivity, good isothermal property, the heat transfer area on both sides of the cold and hot sides can be changed arbitrarily, long-distance heat transfer, and temperature can be controlled. The heat pipe heat exchanger composed of heat pipes has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss, and is beneficial to control dew point corrosion. At present, it has been widely u...

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Problems solved by technology

[0010] The present invention aims at the above-mentioned deficiencies existing in most of the existing heat pipes and heat plates, and proposes a network-type aluminum substrate multi-heat sink radiator that can be used in electronic products. The hot plate is a copper-based material, which is an expensive technical problem; at the same time, it solves the problem that the heat dissipation and temperature uniformity of the heat pipe are not good enough. The VC hot plate has a good temperature uniformity effect, but the transmission distance is limited, and it continues to expand. The cost is very high and the effect is not good. technical challenge

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