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Leadframe for semiconductor devices, corresponding semiconductor product and method

A lead frame and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems affecting the airtightness of the package, and achieve the effect of increasing the airtightness

Pending Publication Date: 2021-06-22
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0015] However, reliability testing performed on this arrangement indicates that delamination can still occur between the molding compound and the underetched die pad, and the resulting gap can affect the hermeticity of the package

Method used

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  • Leadframe for semiconductor devices, corresponding semiconductor product and method
  • Leadframe for semiconductor devices, corresponding semiconductor product and method
  • Leadframe for semiconductor devices, corresponding semiconductor product and method

Examples

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Embodiment Construction

[0041] In the ensuing description, one or more specific details are shown, intended to provide an in-depth understanding of examples of embodiments of the present description. Embodiments may be obtained without one or more of the specific details, or using other methods, components, materials, and the like. In other instances, known structures, materials, or operations are not shown or described in detail so as not to obscure certain aspects of the embodiments.

[0042] References to "one embodiment" or "an embodiment" within the framework of this specification are intended to indicate that a specific configuration, structure or feature described in relation to the embodiment is included in at least one embodiment. Thus, phrases such as "in one embodiment" or "in one embodiment" which may appear at one or more points in this specification do not necessarily refer to one or the same embodiment.

[0043] Furthermore, particular configurations, structures or characteristics may...

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PUM

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Abstract

The embodiment of the invention relates to a leadframe for semiconductor devices, a corresponding semiconductor product and a method. A leadframe for semiconductor devices, the leadframe comprising a die pad portion having a first planar die-mounting surface and a second planar surface opposed the first surface, the first surface and the second surface having facing peripheral rims jointly defining a peripheral outline of the die pad wherein the die pad comprises at least one package molding compound receiving cavity opening at the periphery of said first planar surface.

Description

[0001] priority claim [0002] This application claims priority from Italian Patent Application No. 102019000025009 filed on December 20, 2019, the entire contents of which are incorporated by reference into this application to the fullest extent permitted by law. technical field [0003] This specification relates to integrated circuit (IC) manufacturing technology. [0004] In particular, one or more embodiments may be applied to quad flat no-lead packages (QFN) or quad flat package (QFP) exposed pads (QFN-ep, QFP-ep ) semiconductor package, and its manufacturing method. [0005] One or more embodiments may be applied to pre-molded lead frames molded in a flat configuration and suitable for packaging applications using surface mount technology (SMT). Background technique [0006] Conventionally, the IC die is enclosed in a plastic package that provides protection for the IC die from the environment and facilitates electrical interconnection between the IC die and an und...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48
CPCH01L23/49541H01L21/4821H01L21/4828H01L23/49503H01L2224/48247H01L2224/73265H01L2224/32245H01L2924/181H01L24/48H01L23/3142H01L23/3107H01L2224/45099H01L2924/00012H01L2924/00014H01L21/4825H01L21/565H01L23/3114H01L23/4952H01L23/49548H01L23/562
Inventor R·蒂齐亚尼M·马佐拉
Owner STMICROELECTRONICS SRL