MEMS pressure sensor packaging structure

Abstract

The invention discloses an MEMS pressure sensor packaging structure which is characterized in that a group of oppositely arranged metal pole plates are attached to the inner side wall of a shell, an electric field can be formed after voltage is applied to the metal pole plates, external dirt permeating into a sealed cavity moves and gathers towards the metal pole plates according to the dielectric separation effect and under the action of the electric field, and therefore the dirt can be separated from the sealed cavity. And under the action of gravity, the dirt falls into the dirt collecting groove at the bottom end of the metal pole plate, so that the problem that in the prior art, the packaging air tightness is gradually reduced along with the increase of the working time of the sensor, so that external dirt enters the packaging cavity and sinks to the surface of the MEMS pressure sensor chip, and the performance of the sensor is reduced is solved. In addition, the cover-shaped corrugated diaphragm and the connecting mode thereof can effectively improve the packaging air tightness of sealant assembly, and the prestress and thermal stress on the corrugated diaphragm are reduced; and the corrugated diaphragm is made of a high-toughness ceramic material, so that corrosion and damage to the corrugated diaphragm caused by a severe working environment can be inhibited.

Description

Technical field [0001] The present invention relates to a sensor package structure, and is specifically involved in a MEMS (Micro-Electro-MeChanical System, Microelectronics) Pressure Sensor Packaging Structure. Background technique [0002] The sensor's package can isolate the interference of the MEMS sensor chip and the outside world, inhibit and block the external environment, and also have functions such as electrical connection, thermal management and enhancement mechanical strength. On the other hand, the packaging of the sensor is extremely vulnerable to the performance of the sensor. [0003] According to the material of the pressure sensor package housing, the packaging form of the MEMS pressure sensor is mainly divided into plastic packages, metal packages, and ceramic packages. The MEMS pressure sensor package structure is equipped with mainly including welding assembly and sealing fittings. For the MEMS pressure sensor package structure with corrugated film and silico...

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: Aiming at the above-mentioned prior art, a MEMS pressure sensor packaging structure is proposed to solve the problem that the airtightness of the package gradually decreases with the increase of the working time of the sensor, causing external dirt to enter the packaging cavity and then sink to the surface of the MEMS pressure sensor chip. resulting in the degradation of sensor performance

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