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Method of manufacturing ultrasonic sensors

A sensor and ultrasonic technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, fluids using vibration, piezoelectric devices/electrostrictive devices, etc., can solve the problem of quality degradation of piezoelectric rods and the yield rate of ultrasonic sensors low level problem

Pending Publication Date: 2021-06-22
BTBL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cutting of the piezoelectric rod takes a lot of time, resulting in a low yield rate of the ultrasonic sensor and possibly deteriorating the quality of the piezoelectric rod

Method used

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  • Method of manufacturing ultrasonic sensors
  • Method of manufacturing ultrasonic sensors
  • Method of manufacturing ultrasonic sensors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079]Micropatterns with a line width of 50 μm were formed on a silicon wafer by photolithography. PZT piezoelectric powder (average particle size = 0.5 μm to 3 μm) was filled into the concave portion of the micropattern by spraying, pressurized at 300 MPa, heated at 1 °C / min, kept at 850 °C for 2 hours, and heated at 1 °C / min cooling. Repeat the sintering and cooling steps under the same conditions. The substrate is removed by photolithography, filled with epoxy resin insulating material, metal gold is deposited, the wire electrodes are patterned by photolithography, and cut into ultrasonic sensors.

Embodiment 2

[0081] An ultrasonic sensor was fabricated in the same manner as in Example 1 except that pressurization was performed at 400 MPa.

experiment example 1

[0085] The ultrasonic sensors of Comparative Example 1 and Examples 1 to 2 were imaged using a scanning electron microscope (SEM). The image is shown in Figures 8 to 11 middle. refer to Figure 9 , in the ultrasonic sensor of Comparative Example 1, a large number of pores were formed between particles having smaller particle diameters. On the contrary, in embodiment 1 to 2 (see Figure 10 and 11 ) of the ultrasonic sensor, a smaller number of pores are formed between particles with larger particle diameters.

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Abstract

Disclosed is a method of manufacturing ultrasonic sensors. The method includes forming a micropattern having concave and convex portions on an etchable substrate, filling a piezoelectric material in the concave portions of the micropattern, pressurizing the filled piezoelectric material, sintering the piezoelectric material to form preliminary piezoelectric bodies, re-sintering the preliminary piezoelectric bodies to form densely packed unit piezoelectric bodies, and forming electrode terminals at both ends of each of the unit piezoelectric bodies to produce a unit piezoelectric cell. The method enables the manufacture of high-quality ultrasonic sensors in high yield.

Description

technical field [0001] The present invention relates to methods of manufacturing ultrasonic sensors, and more particularly to methods of manufacturing high quality ultrasonic sensors with a high yield. Background technique [0002] In an ultrasonic sensor array, an ultrasonic transmitter can be used to transmit ultrasonic waves to an object to be detected through one or more ultrasonic transmission media. The transmitter may be operatively coupled to an ultrasonic sensor configured to detect the portion of ultrasonic waves reflected from the object. For example, in an ultrasonic fingerprint imager, ultrasonic pulses can be generated by activating and deactivating transmitters during very short time intervals. At each material interface that the ultrasonic pulse encounters, a portion of the ultrasonic pulse is reflected. [0003] For example, in the case of an ultrasonic fingerprint imager, ultrasonic waves can travel through a platen on which a person's finger can be place...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/43H01L41/09H01L41/047H01L41/187
CPCB06B1/0629H10N30/084H10N30/097H10N30/87H10N30/20H10N30/8536H10N30/8548H10N30/082H10N30/877
Inventor 金永圭朴庆玉李承晋
Owner BTBL CO LTD