Anisotropic conductive adhesive and pasting method

An anisotropic conductive adhesive and lamination technology, applied in conductive adhesives, adhesive heating bonding methods, etc., can solve the problem of affecting the yield of the back-end process of the product, difficult to achieve special-shaped attachment, waste of cost, etc. question

Inactive Publication Date: 2021-06-29
INTERFACE TECH CHENGDU CO LTD +3
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the current anisotropic conductive adhesive is an adhesive tape with uniform thickness. With a certain height difference, the surface of the anisotropic conductive adhesive covering the gold finger protrudes compared with the surface directly covering the substrate, making the surface away from the substrate uneven.
This leads to the fact that in the hot pressing process, due to the high pressure, the base material of the flexible circuit board is sunken in the direction of the object to be bonded in the area where the gold finger is not provided relative to the area where the gold finger is provided, which in turn causes the entire base material It is in the shape of water ripples, which affects the yield rate in the back-end process of the product
In addition, if the bonding area of ​​the object to be bonded has irregular-shaped edges (that is, the bonding area has non-linear distribution edges), the traditional anisotropic conductive adhesive may be difficult to achieve special-shaped attachment, or it needs to be attached after attachment. Additional boundary cropping, wasting cost

Method used

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  • Anisotropic conductive adhesive and pasting method

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0032] In order to further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred implementation modes.

[0033] An emb...

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Abstract

The embodiment of the invention provides an anisotropic conductive adhesive and a pasting method. The anisotropic conductive adhesive comprises a liquid optical transparent adhesive and a plurality of conductive particles mixed in the liquid optical transparent adhesive, wherein each conductive particle comprises a conductive ball and an insulating layer wrapping the conductive ball.

Description

technical field [0001] The invention relates to the technical field of bonding, in particular to an anisotropic conductive adhesive and a bonding method. Background technique [0002] Anisotropic conductive adhesives are often used in the hot-press lamination process of touch panels to bond an object (such as a touch panel) to a flexible circuit board, and use its anisotropic conductive properties to Realize the electrical connection between the object to be bonded and the flexible circuit board. [0003] However, the current anisotropic conductive adhesive is an adhesive tape with uniform thickness. With a certain height difference, the surface of the anisotropic conductive adhesive covering the gold finger protrudes compared with the surface directly covering the substrate, so that the surface away from the substrate is uneven. This leads to the fact that in the hot pressing process, due to the high pressure, the base material of the flexible circuit board is sunken in t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J5/06
CPCC09J9/02C09J5/06
Inventor 张天宇许家汉
Owner INTERFACE TECH CHENGDU CO LTD
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