Magnetron sputtering coating uniformity adjusting device and adjusting method

Abstract

The invention discloses a magnetron sputtering coating uniformity adjusting device and an adjusting method. The magnetron sputtering coating uniformity adjusting device comprises a gas storage mechanism for storing inert gas, a gas inlet pipe, a ventilation pipe, a vacuum cavity and a target material, wherein the ventilation pipe is connected to the gas storage mechanism through the gas inlet pipe; the ventilation pipe is vertically arranged in the vacuum cavity and is provided with a plurality of gas holes facing the target material; the height positions of the gas holes are different, and the device further comprises a control mechanism used for controlling the gas flow of the gas holes at different height positions according to the film thickness of a coated base material. The magnetron sputtering coating uniformity adjusting device provided by the invention is simple in structure and convenient to use, and can flexibly adjust the gas flow at different height positions in the magnetron sputtering process; and film layer stacking cannot occur, errors of uniformity of an electric field and a magnetic field, consistency of the distance between the target material and a coated substrate and the like are allowed, and the adjusting process is convenient and easy to control.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering equipment, in particular to a magnetron sputtering coating uniformity adjustment device. In addition, the present invention also relates to an adjustment method applied to the above-mentioned magnetron sputtering coating uniformity adjustment device. Background technique [0002] In the existing technology, such as Figure 1 to Figure 3 As shown, in order to improve the uniformity of the magnetron sputtering equipment in the coating process, a movable correction baffle will be installed in the equipment cavity, and a metal rack 05 is set on the correction baffle, and the metal rack 05 is set on the target 02 and the target 02. Between the substrates 03 to be plated, the amount of target particles that the sputtering source of the target 02 passes through and deposits on the substrate 03 to be plated can be controlled by replacing the metal rack 05 of different lengths, thereby control...

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Problems solved by technology

[0002] In the existing technology, such as Figure 1 to Figure 3 As shown, in order to improve the uniformity of the magnetron sputtering equipment in the coating process, a movable correction baffle will be installed in the equipment cavity, and a metal rack 05 is set on the correction baffle, and the metal rack 05 is set on the target 02 and the target 02. Between the substrates 03 to be plated, the amount of target particles that the sputtering source of the target 02 passes through and deposits on the substrate 03 to be plated can be controlled by replacing the metal rack 05 of different lengths, thereby controlling the amount of the target material to be plated. 03 The effect of coating uniformity; however, due to the complex structure of the correction baffle, the difficulty of mechanical maintenance, the installation screws are easy to stack the film material, and too many wearing parts, the structure of the magnetron sputtering equipment is complicated and the cost increases

[0003] There are strict restrictions on the pressure and flow rate of the gas flowing through the gas pipe, and it is necessary to cooperate with uniform electric field, uniform magnetic field, and uniform distance between the target 02 and the substrate to be plated 03 to achieve uniformity in the coating process. In the process of actual use, a device that adjusts the uniformity of the coating film by adjusting the uniformity of the magnetic field and the strength of the magnetic field is generally used. The structure of this device is complicated and the debugging operation is troublesome. It is difficult to achieve absolute uniformity, inconvenient to adjust, and difficult to implement

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