Impedance matching method and semiconductor process equipment

Abstract

The invention provides an impedance matching method of semiconductor process equipment, which comprises the following steps: a capacitance value determination stage: detecting stable capacitance values of a plurality of capacitors in a matcher after build-up of luminance occurs in a process chamber and the matcher completes automatic matching; a matching stage: the capacitance value of one capacitor in the matcher is adjusted to be the corresponding luminance build-up capacitance value, the capacitance values of the other multiple capacitors are adjusted to be the corresponding stable capacitance values, and the luminance build-up capacitance value of the capacitor is smaller than the stable capacitance value of the capacitor; and the power supply is started, and the capacitance value of a capacitor from the build-up capacitance value is adjusted to the stable capacitance value of the capacitor. According to the impedance matching method provided by the invention, rapid and stable build-up of luminance can be realized, the matching time of the matcher is shortened, and the consistency of process results is improved. The invention also provides semiconductor process equipment.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, in particular to an impedance matching method for semiconductor technology equipment and semiconductor technology equipment. Background technique [0002] The inductively coupled plasma source is used in etching, thin film deposition, ion implantation and doping in the field of semiconductor equipment manufacturing. Ion bombardment energy. A typical RF discharge plasma generation system usually includes a RF power supply with a frequency of 13.56MHz and an output impedance of 50Ω, and a plasma reaction chamber with an inductively coupled coil and an electrostatic chuck inside. The transmission line theory points out that when the characteristic impedance of the power supply is different from the load impedance, the output power of the RF power supply will be lost, and the output efficiency cannot be maximized, resulting in energy waste, which may cause damage to the power supply i...

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Problems solved by technology

[0005] However, the time required for the matcher to perform impedance matching in the Auto preset mode depends on the matcher algorithm and the selection of the preset position, and the difference in the initial capacitance value of each variable capacitor and the initial state of the plasma will also lead to a different matching process, and lead to inconsistent matching times

Due to the limitation of the algorithm, when the initial capacitance value position of the variable capacitor is poor, the matching time sometimes reaches 4-5s, which has a great impact on the stability of the process result.

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