Forming curing mold for plastic-sealed diode production and implementation method of forming curing mold

Abstract

The invention discloses a forming curing mold for plastic-sealed diode production and an implementation method of the forming curing mold, and belongs to the technical field of plastic-sealed diode production. The forming curing mold comprises a base, wherein a curing mold assembly is arranged above the base, a demolding ejection assembly is arranged on the lower portion in the curing mold assembly, a cooling assembly is arranged in the curing mold assembly, a power assembly is connected to the upper portion of the curing mold assembly, and an injection molding assembly is connected to the upper portion of the power assembly above the curing mold assembly. According to the forming curing mold for plastic-sealed diode production and the implementation method of the forming curing mold, injection molding liquid is prevented from leaking, the quality of plastic-sealed objects is improved, the demolding efficiency is improved, the inconvenience of manual demolding is reduced, and the effect of rapid curing is achieved; water resource waste is reduced through circular cooling, and the cooling efficiency is also greatly improved; and the mechanical energy of an upper mold base is effectively guided, the pressing precision is improved, the joint closing efficiency is guaranteed, the injection molding efficiency is improved, the situation that internal liquid solidifies to block an inner groove in the next injection molding process can be avoided, and the dredging efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of plastic-encapsulated diode production, in particular to a molding and curing mold for the production of plastic-encapsulated diodes and an implementation method thereof. Background technique [0002] A diode is a device with two electrodes that only allows current to flow in one direction. Many uses apply its rectifying function. When making a diode, solder the chip in the lead frame with each channel structure, then put the frame connected chip into the injection mold, and then inject a fluid insulating material into the mold through the injection molding machine, and the insulating material will come off after cooling and molding. The mold is taken out, and an independent diode is obtained by cutting. The plastic sealing mold of the diode mainly includes an upper and lower mold structure. Generally, a concave cavity structure is set in the lower mold, and the lead frame with the chip welded is placed b...

AI Technical Summary

Problems solved by technology

The plastic sealing mold of the diode mainly includes an upper and lower mold structure. Generally, a concave cavity structure is set in the lower mold, and the lead frame with the chip welded is placed between the upper and lower molds, and a cavity is formed between the upper and lower molds. Inject fluid-like insulating material. Since the insulating material has fluidity and the bottom of the mold cavity is flat, the insulating material is easy to overflow, and it is troublesome to take the mold, which is easy to damage the diode.

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