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Forming curing mold for plastic-sealed diode production and implementation method of forming curing mold

A technology for curing molds and diodes, which is applied in household appliances, other household appliances, applications, etc., can solve the problems of easily damaged diodes, easy overflow of insulating materials, troublesome mold taking, etc., to reduce waste of water resources, improve demoulding efficiency, Effect of preventing leakage of injection molding liquid

Inactive Publication Date: 2021-07-09
赣龙微电子科技(定南)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The plastic sealing mold of the diode mainly includes an upper and lower mold structure. Generally, a concave cavity structure is set in the lower mold, and the lead frame with the chip welded is placed between the upper and lower molds, and a cavity is formed between the upper and lower molds. Inject fluid-like insulating material. Since the insulating material has fluidity and the bottom of the mold cavity is flat, the insulating material is easy to overflow, and it is troublesome to take the mold, which is easy to damage the diode.

Method used

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  • Forming curing mold for plastic-sealed diode production and implementation method of forming curing mold
  • Forming curing mold for plastic-sealed diode production and implementation method of forming curing mold
  • Forming curing mold for plastic-sealed diode production and implementation method of forming curing mold

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Embodiment approach

[0042] In order to better demonstrate the implementation process of the molding and curing mold for the production of plastic-encapsulated diodes, this embodiment proposes a method for implementing the molding and curing mold for the production of plastic-encapsulated diodes, including the following steps:

[0043] Step 1: Place the object to be plastic-sealed in the lower mold groove 24 from the packaging placement groove 25, and the upper mold base 21 below the upper pressing plate 53 is driven down by the telescopic rod 52 above the pressing cylinder 51, thereby pressing the upper mold base 21 and the lower mold base. Die base 22 is pressed and closed;

[0044] Step 2: After the upper mold base 21 and the lower mold base 22 are pressed together, the screw 63 is rotated to drive the piston 65 to extrude the injection molding in the injection pipe 61, and the injection liquid is squeezed into the main injection groove 671, and a plurality of injection shunt grooves 672 and th...

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Abstract

The invention discloses a forming curing mold for plastic-sealed diode production and an implementation method of the forming curing mold, and belongs to the technical field of plastic-sealed diode production. The forming curing mold comprises a base, wherein a curing mold assembly is arranged above the base, a demolding ejection assembly is arranged on the lower portion in the curing mold assembly, a cooling assembly is arranged in the curing mold assembly, a power assembly is connected to the upper portion of the curing mold assembly, and an injection molding assembly is connected to the upper portion of the power assembly above the curing mold assembly. According to the forming curing mold for plastic-sealed diode production and the implementation method of the forming curing mold, injection molding liquid is prevented from leaking, the quality of plastic-sealed objects is improved, the demolding efficiency is improved, the inconvenience of manual demolding is reduced, and the effect of rapid curing is achieved; water resource waste is reduced through circular cooling, and the cooling efficiency is also greatly improved; and the mechanical energy of an upper mold base is effectively guided, the pressing precision is improved, the joint closing efficiency is guaranteed, the injection molding efficiency is improved, the situation that internal liquid solidifies to block an inner groove in the next injection molding process can be avoided, and the dredging efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of plastic-encapsulated diode production, in particular to a molding and curing mold for the production of plastic-encapsulated diodes and an implementation method thereof. Background technique [0002] A diode is a device with two electrodes that only allows current to flow in one direction. Many uses apply its rectifying function. When making a diode, solder the chip in the lead frame with each channel structure, then put the frame connected chip into the injection mold, and then inject a fluid insulating material into the mold through the injection molding machine, and the insulating material will come off after cooling and molding. The mold is taken out, and an independent diode is obtained by cutting. The plastic sealing mold of the diode mainly includes an upper and lower mold structure. Generally, a concave cavity structure is set in the lower mold, and the lead frame with the chip welded is placed b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/26B29C45/40B29C45/73B29C45/67B29L31/34
CPCB29C45/2602B29C45/4005B29C45/67B29C45/7312B29C45/7331B29C2045/2683B29C2045/6792B29C2045/7318B29L2031/34
Inventor 苏晓刚谢慈善
Owner 赣龙微电子科技(定南)有限公司
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