Power supply module and electronic device

Abstract

The invention provides a power supply module and an electronic device, the power supply module is used for an integrated circuit chip assembly, the integrated circuit chip assembly comprises an integrated circuit chip and a first carrier plate, and the integrated circuit chip is located at a first side of the first carrier plate; the power module includes: a second carrier plate; a first-stage power supply unit; and a second-stage power supply unit, wherein a power input terminal of the second-stage power supply unit is electrically connected with a power output terminal of the first-stage power supply unit through the second carrier plate. The power output terminal of the second-stage power supply unit is electrically connected with the power terminal of the integrated circuit chip, the projection of the second-stage power supply unit on a first plane is at least partially located in the projection range of the integrated circuit chip on the first plane, and the first plane is parallel to the first carrier plate. According to the power supply module, vertical power supply to the integrated circuit chip is realized, and meanwhile, the occupation of the space of the first carrier plate is reduced.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a power supply module and an electronic device. Background technique [0002] Smart IC (Integrated Circuit, integrated circuit) chips for data centers or smart terminals, whether in BGA (Ball Grid Array, solder ball array) package or in the form of connection with a base (Socket), have more and more functions. The power consumption is getting larger and larger, and a larger input current needs to be provided. But at the same time, the demand for anti-interference signal lines on the main board is also increasing, and the number of electronic devices on the main board is also increasing. How to make the power module occupy less resources on the main board, minimize the interference on the smart IC and the signal lines on the main board, and It is a new demand for intelligent IC power modules that can flexibly take into account various application requirements. In the t...

AI Technical Summary

Problems solved by technology

In the traditional horizontal power supply scheme, the current transmission path is long, which is not conducive to improving the efficiency and dynamic performance of the power module, and takes up more motherboard resources, making it inconvenient to flexibly arrange other electronic devices on the motherboard

Moreover, the traditional horizontal power supply scheme often needs to pass through the area where the signal lines on the motherboard are located, which greatly interferes with the signal lines

Placing the power module under the smart IC for vertical power supply is an optimized and efficient power supply solution. However, the input current of the power module also needs to be transmitted horizontally through the system motherboard, which still causes interference to signal lines and low transmission efficiency. question

Images