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Tower type voltage doubling circuit structure

A voltage doubling circuit, tower-type technology, applied in the field of tower-type voltage doubling circuit structure, can solve the problem that the voltage doubling circuit occupies a large volume and achieve the effect of reducing the occupied space

Inactive Publication Date: 2021-07-13
江苏迪业检测科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the embodiments of the present application is to overcome the deficiencies of the existing technology and provide a tower-type voltage doubler circuit structure to solve the problem that the voltage doubler circuit occupies a large volume

Method used

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  • Tower type voltage doubling circuit structure
  • Tower type voltage doubling circuit structure

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Effect test

Embodiment

[0053] like figure 1 As shown, a tower-type voltage doubling circuit structure provided by the embodiment of the present invention includes: a base 1, a capacitor plate group 2, a diode outer plate group 3, a diode inner plate group 4 and a resistor plate 5, and the diode The outer board group 3 and the capacitor board group 2 are arranged on the base 1 to form a frame structure, the diode inner board group 4 is arranged in the middle of the frame structure, and the two sides of the diode inner board group 4 It is clamped and fixed with the capacitor plate set 2 , and the resistor plate 5 is clamped in the diode outer plate set 3 .

[0054] Wherein, the base 1 is made of insulating material such as plastic, and is used for isolating the low-voltage side devices such as the transformer 14 arranged under the base 1 .

[0055] The diodes, capacitors and resistors in the voltage doubler circuit are grouped and installed on the diode outer plate group 3, the diode inner plate grou...

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PUM

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Abstract

The invention belongs to the technical field of voltage doubling circuits, and particularly relates to a tower type voltage doubling circuit structure. The structure comprises a base, a capacitor plate group, a diode outer plate group, a diode inner plate group and a resistance plate; the diode outer plate group and the capacitor plate group are arranged on the base to form a frame-shaped structure, the diode inner plate group is arranged in the middle of the frame-shaped structure, two sides of the diode inner plate group are fixedly clamped with the capacitor plate group, and the resistance plate is clamped in the diode outer plate group. The voltage doubling circuit is used for solving the problem that a voltage doubling circuit occupies a large space. Diodes, capacitors and resistors in a voltage doubling circuit are respectively arranged on a diode outer plate group, a diode inner plate group, a capacitor plate group and a resistor plate in groups, then the diode outer plate group and the capacitor group form a frame-shaped structure, and the diode inner plate group and the resistor plate are arranged in the frame-shaped structure; a voltage doubling circuit originally arranged on one board is disassembled and assembled to form a tower structure, the whole occupied space is reduced, and the voltage doubling circuit can be miniaturized.

Description

technical field [0001] The invention belongs to the technical field of voltage doubling circuits, in particular to a tower-type voltage doubling circuit structure. Background technique [0002] In the field of integrated circuits, it is often necessary to boost the input voltage, for example, output a voltage twice the input voltage after boosting, for which various voltage doubler circuits have been developed in the prior art. [0003] However, the current voltage doubling circuit usually designs the entire circuit layout on an integrated board. This layout method will cause the entire voltage doubling circuit board to occupy a larger plane area. For miniaturized devices using a voltage doubling circuit , it will make it difficult to miniaturize the device, and the voltage doubler circuit board will occupy a large space inside the entire device. Contents of the invention [0004] The technical problem to be solved by the embodiments of the present application is to overc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00
CPCH02M1/00
Inventor 何晓东
Owner 江苏迪业检测科技有限公司