Copper-clad plate production and machining technology

A processing technology, copper-clad laminate technology, applied in the field of copper-clad laminate production and processing technology, can solve the problems of slitting structure, slitting effect and slitting speed adverse effects, low control of copper-clad laminate, easy residual crumbs and other problems, to improve the overall The effect of utilization rate, improving cutting quality and maintaining smoothness

Inactive Publication Date: 2021-07-16
王真真
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The shearing function of the copper clad laminate shearing equipment is relatively simple. It can only support shearing in one direction, and the size of the sheared copper clad laminate is fixed. At the same time, the equipment has a low degree of control over the overall size of the copper clad laminate, so that There are a lot of leftover scraps on the copper plate, which causes waste;
[0004] 2. There is a deviation between the slitting structure and the slitting point when there is no guide and limit. At the same time, the surface of the execution end of the slitting mechanism is more prone to residual crumbs, and the existence of crumbs is easier to affect the separation of the slitting structure. Cutting effect and cutting speed cause adverse effects

Method used

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  • Copper-clad plate production and machining technology
  • Copper-clad plate production and machining technology
  • Copper-clad plate production and machining technology

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Embodiment Construction

[0045] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways as defined and covered by the claims.

[0046] Such as Figure 1 to Figure 14 A copper-clad laminate production and processing process is shown, which uses a copper-clad laminate production and processing device. The copper-clad laminate production and processing device includes a workbench 1, a clamping mechanism 2 and a shearing mechanism 3, and the copper-clad laminate production and processing device is used to process the copper-clad laminate. The specific processing technology during production and processing is as follows:

[0047] S1. Copper-clad laminate molding: prepare resin solution, inject the prepared resin solution into the glue machine, and continuously impregnate and dry through the glue machine to make semi-finished products, and then use the press to layer the semi-f...

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Abstract

The invention relates to a copper-clad plate production and machining technology. A copper-clad plate production and machining device is used, the copper-clad plate production and machining device comprises a workbench, a clamping and fixing mechanism and a shearing mechanism, wherein the workbench is installed on the existing ground, the clamping and fixing mechanism is arranged in the middle of the upper end of the workbench, and the shearing mechanism is arranged above the clamping and fixing mechanism. According to the copper-clad plate production and machining technology, the copper-clad plate is produced and machined by adopting a design concept of combining multiple regulation and control structures, and the shearing mechanism can integrally realize rapid switching between transverse slitting and vertical slitting of the copper-clad plate, so that the diversity of the copper-clad plate machined by the device is greatly improved, meanwhile, the shearing mechanism can achieve edge pressing and slitting guiding and limiting of a slitting point of the copper-clad plate as well, then the overall slitting quality of the copper-clad plate is improved, and the distance between the clamping and fixing mechanism and the shearing mechanism can be adaptively adjusted according to the thickness size of the copper-clad plate.

Description

technical field [0001] The invention relates to the field of copper-clad laminate processing, in particular to a production and processing technique for copper-clad laminates. Background technique [0002] Copper-clad laminates generally refer to copper-clad laminates. Copper-clad laminates are plate-like materials made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. , referred to as copper-clad laminates, various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on copper-clad laminates to make different printed circuits. The copper plate mainly plays the role of interconnection, insulation and support for the printed circuit board, and has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. The manufacture of copper clad laminates mainly passes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/08B26D5/06B26D5/08B26D7/02B26D7/08B26D7/32B26D7/00
CPCB26D1/08B26D5/06B26D5/086B26D7/00B26D7/02B26D7/088B26D7/32
Inventor 王真真
Owner 王真真
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