Flip-chip laser device and manufacturing method thereof

Abstract

An embodiment of the invention provides a flip-chip laser device and a manufacturing method. The flip-chip laser device comprises a substrate, an epitaxial layer group arranged on the substrate, a first electrode arranged on one side, far away from the epitaxial layer group, of the substrate, and a second electrode arranged on one side, far away from the substrate, of the epitaxial layer group, wherein a light emitting region is formed in the epitaxial layer group, and the position of the first electrode corresponds to the position of the light emitting region; and a through hole vertically penetrating through the substrate and the epitaxial layer group is formed in the substrate and the epitaxial layer group, and the position of the through hole corresponds to the position of the second electrode. In addition, the flip-chip laser device further comprises an insulating layer formed on the inner wall of the through hole and conductive metal formed in the through hole, and the conductive metal leads the second electrode to the side, away from the epitaxial layer set, of the substrate. Therefore, the second electrode can be led to one side of the substrate without turning the device, light can be emitted from the epitaxial layer group from the light emitting region without passing through the substrate and being limited by an energy gap of the substrate, and products with various wavelengths can be produced according to actual application requirements.

Description

technical field [0001] The present application relates to the field of semiconductor technology, in particular, to a flip-chip laser device and a manufacturing method. Background technique [0002] Flip-chip packaging technology can simplify the gold wire packaging process and reduce the cost of lead frame and wire bonding because it does not need to use gold wires for wire bonding and other processes. Therefore, flip-chip packaging is often used in the current packaging process. [0003] When vertical-cavity surface-emitting laser (Vertical-Cavity Surface-Emitting Laser, VCSEL) adopts flip-chip packaging, the electrodes need to be connected to the packaging substrate. Therefore, after packaging, the substrate of the laser device faces upward, and the light must pass through the substrate The bottom is light. Due to the energy gap of different substrates and different wavelengths of light, some wavelengths of light may be absorbed by the substrate and cannot pass through t...

AI Technical Summary

Problems solved by technology

Due to the energy gap of different substrates and different wavelengths of light, some wavelengths of light may be absorbed by the substrate and cannot pass through the substrate.

Therefore, it is difficult for current laser devices to produce products of various wavelengths and adapt to diverse wavelength requirements when they are applied to flip-chip packaging.

Images