Electromagnetic wave-absorbing material and electromagnetic wave-absorbing patch
An electromagnetic wave-absorbing, patch-type technology, applied in the direction of electrical components, magnetic field/electric field shielding, etc., can solve the problems of inability to spread evenly on the surface of electronic products, difficulty in overcoming heat dissipation problems, difficulty in adapting to installation space, etc., to achieve large-scale The effect of manufacturing, excellent heat transfer performance and microwave absorption performance, and good microwave absorption characteristics
Inactive Publication Date: 2021-07-16
CHANGPING BEIJING ELECTROMAGNETIC PROTECTION
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Problems solved by technology
Although there are various shielding devices in the prior art, there are still few products for electromagnetic shielding for thin electronic products, chips, and patches. Even if there are, it is difficult to overcome the problem of heat dissipation. It is difficult to match the size of the electronic chip, and it is difficult to be suitable for occasions where the installation space is small. From the perspective of heat dissipation function, it will produce a point heat source phenomenon, and it cannot be spread evenly along the surface of the electronic product
Method used
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[0019] By the description of the embodiments, the present invention will not be understood by the following description, but the specific embodiments given by the applicant should not be regarded as limiting the technical solution of the present invention, any of the technical characteristics. Definitions Change and / or to the form of the present invention should be considered as defined by the technical solutions of the present invention.
[0020] A patch type electromagnetic absorbing material, including graphite composite component, an absorbing component, wherein:
[0021] According to the weight percentage content, the graphite composite component includes 15 to 18 graphite powder, 17 to 19 zinc oxide, 1 ~ 2 parts of the tin dioxide powder, 1 to 2 sulfur powder, 1-2 of the hexamethylbenzene 1-2 Series, binder 1.2 to 1.4 parts, suspending agent 1.3 to 1.5 parts, auxiliary agent 0.2 to 0.3 parts.
[0022] According to the weight percentage content, the absorbing component incl...
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The invention discloses a patch type electromagnetic wave-absorbing material and an electromagnetic wave-absorbing sheet. The electromagnetic wave-absorbing material comprises a graphite composite component and a wave-absorbing component. The electromagnetic wave-absorbing sheet is of a composite layer structure and comprises a graphite layer and a wave-absorbing layer, a release film is fixedly connected between the graphite layer and the wave-absorbing layer in a bonding mode, and the release film is composed of a heat conduction layer and an absorption layer. The material has the advantages that compared with a heat conduction material or an electromagnetic wave-absorbing material in the prior art, the electromagnetic wave-absorbing material is added, so that the wave-absorbing material and the wave-absorbing patch have the good heat dissipation characteristic and the good wave-absorbing characteristic, and have good mechanical property, flexibility, weather resistance and corrosion resistance; the preparation process is simple, large-scale production and manufacturing are facilitated, excellent heat transfer performance and wave-absorbing performance are achieved, and the material is suitable for various different sheet wave-absorbing materials.
Description
Technical field [0001] The present invention relates to an absorbing material and an absorbing patch, and more particularly to an electromagnetic absorbing material and an electromagnetic absorbing patch. Background technique [0002] High-speed operating electronic devices, thinning of electronic products is a general trend, and corresponding problems that will bring electromagnetic safety, especially for thin electronic products, electromagnetic masking is the subject to study. Although various shielding devices have been present in the prior art, the electromagnetic shielded products for thin electronics, chips, and patch are still few, even if they are difficult to overcome heat dissipation problems, prior art absorbing materials or absorbing products It is difficult to do with the electronic chip in size, it is difficult to apply to a small installation space. From the heat dissipation function, it will generate a hot source phenomenon, and it cannot be uniformly spread alon...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K9/00C04B28/00C04B26/00
CPCH05K9/0081C04B28/00C04B26/00C04B2111/00258C04B14/024C04B14/30C04B22/02C04B24/045C04B24/2641C04B24/00C04B2103/0068
Inventor 蔡鹏飞何山高鹏商红凯李晶晶
Owner CHANGPING BEIJING ELECTROMAGNETIC PROTECTION