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Metal processing device for coating on bonding copper wire

A technology for metal processing and bonding copper wire, which is applied to the device, coating, and electrical components that apply liquid to the surface. and other problems to achieve the effect of improving work efficiency

Active Publication Date: 2021-07-20
湖北钰嵘铜材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the problem of poor electrical conductivity and high price of the bonding wire, but because the graphene coating on the bonding copper wire cannot allow all sides of the bonding copper wire to be coated, it will lead to bonding of copper Wire conductivity and stability will have a great impact on normal use. The technical problem of the present invention is to provide a metal processing device for bonding coatings on copper wires

Method used

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  • Metal processing device for coating on bonding copper wire
  • Metal processing device for coating on bonding copper wire
  • Metal processing device for coating on bonding copper wire

Examples

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Embodiment 1

[0032] Metal processing apparatus for coating on bonded copper wire, such as Figure 1-9 As shown, including the chassis 1, the rocking type friction unit 2, the coating unit 3, the winding unit 4, the control screen 5, and the coating box 6; the chassis 1 is connected to the rocking friction unit 2; the chassis 1 and the coated The cloth unit 3 is connected; the chassis 1 is connected to the winding unit 4; the chassis 1 is connected to the control screen 5; the bottom frame 1 is connected to the coating box 6; the rocking friction unit 2 is connected to the winding unit 4; The wound unit 4 is provided with a coating unit 3 on the side of the winding unit 4; the winding unit 4 is provided with a coating box 6.

[0033] When using, the metal processing apparatus of the bonded copper wire is placed to the position to be used, then the external power source is applied, and then the chassis 1 is placed in a stationary position, and the device is controlled by the control screen 5; fir...

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Abstract

The invention relates to the field of metal processing, in particular to a metal processing device for coating a bonding copper wire. The invention aims to provide the metal processing device for the coating on the bonding copper wire. According to the technical scheme, the metal processing device for the coating on the bonding copper wire comprises a bottom frame, a swing type friction unit, a coating unit, a winding unit, a coating box and the like; wherein the bottom frame is connected with the swing type friction unit. The bottom frame is connected with the coating unit; the bottom frame is connected with the winding unit; the bottom frame is connected with the coating box; the swing type friction unit is connected with the winding unit; the coating unit is arranged on the side edge of the winding unit; and the coating box is arranged below the winding unit. According to the device, the operation of coating the graphene solution coating on the row of bonding copper wires is realized, and the gap parts of the bonding copper wires can be synchronously coated, so that the working efficiency is greatly improved.

Description

Technical field [0001] The present invention relates to a metal processing, and more particularly to a metal processing apparatus for a bonded copper wire. Background technique [0002] At present, the use of integrated circuits and semiconductor components is increasing, in which the use of bonded wires for integrated circuits and semiconductor components is also more and more, but the bonds in prior art products are generally It is more expensive, followed by the integrated circuit for the package density of the bonded wire, which has a more urgent requirement for the alternative to the bonded wire. [0003] China Patent CN107369665B is a method for preparing a graphene bonded copper wire for an existing bonded copper wire, which discloses the preparation of the prepared graphene solution to the bonded copper surface by spin coating method. , Overcoming the problem of poor conductivity and expensive prices of bonded wire, but because the coated graphene coatings on the bonded c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48B05C5/00B05C11/10B05C13/02
CPCH01L21/4885B05C5/00B05C11/10B05C13/02Y02P70/10
Inventor 刘慧琪
Owner 湖北钰嵘铜材有限公司
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