Wafer transfer method and wafer transfer platform

Abstract

The invention discloses a wafer transfer method and a wafer transfer platform. The wafer transfer method comprises the following steps: S1, a first manipulator conveys a wafer in a front open type wafer conveying box into a transition bearing mechanism of a transition chamber; S2, a second manipulator sends the wafer in the transition chamber to a process bearing mechanism in the process chamber for processing; s3, the second manipulator sends the wafer processed by the process chamber into a vacuum bearing mechanism of the vacuum chamber; s4, the steps from S1 to S3 are repeated until the wafers in the open wafer transfer box are all processed by the process chamber and then placed in the vacuum chamber; s5, the processed wafers in the vacuum chamber are sequentially conveyed into the front-open type wafer conveying box through the first manipulator. The processed wafers and the unprocessed wafers are separated, the cross influence of the processed wafers and the unprocessed wafers is avoided, it is ensured that the processed wafers are not polluted, the yield of the wafers is increased, high practicability and popularization value are achieved, the improvement cost is low, and the actual process requirements are met.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a chip transfer system for wafers. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. [0003] When the wafer is produced and processed, it needs to go through a multi-step process, and the wafer needs to be transported through multiple channels during the process; at present, the existing wafer is directly returned to the front after the process is processed in the process chamber. In the open FOUP, the processed wafers are mixed with the unprocessed wafers in the FOUP, which may cause cross-effects between the two, making the pro...

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Problems solved by technology

[0003] When the wafer is produced and processed, it needs to go through a multi-step process, and the wafer needs to be transported through multiple channels during the process; at present, the existing wafer is directly returned to the front after the process is processed in the process chamber. In the open FOUP, the processed wafers are mixed with the unprocessed wafers in the FOUP, which may cause cross-effects between the two, making the processed wafers Contaminated, which has a great impact on the yield of the wafer

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