Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cooling chip mounter for intermittent transportation from fixed rail and chip mounting method

A self-fixing and cooling paste technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of transmission track adaptation, track failure, placement machine failure, etc., to achieve cost-saving effects

Inactive Publication Date: 2021-07-27
周创
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a cooling chip placement machine that can be transported intermittently from a fixed track to solve the problem that the transport track cannot be adapted to pads of different specifications in the above-mentioned background technology, resulting in that the track cannot transport the pads and needs to be replaced. The problem that the track and placement machine cannot work

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cooling chip mounter for intermittent transportation from fixed rail and chip mounting method
  • Cooling chip mounter for intermittent transportation from fixed rail and chip mounting method
  • Cooling chip mounter for intermittent transportation from fixed rail and chip mounting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1-6 , the present invention provides a technical solution, a self-fixed rail intermittently transported cooling placement machine, including a workbench 1, the top of the workbench 1 is pressed against the left and right sides with a support 2, and the top middle of the workbench 1 is installed with a sticker Chip machine 6, outer rail 8 is installed on the top of the two supports 2, and inner rail 7 is installed inside the outer rail 8, and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a cooling chip mounter for intermittent transportation from a fixed rail, which comprises a workbench, and supports tightly abut against the left side and the right side of the top of the workbench. Through the clearance fit between the sliding blocks and the sliding rails and the fixed connection relation between the sliding rails and the outer rail, the bolts are rotated to enable the transverse blocks to move forwards, and then the left square block and the right square block are driven, so that the inner sliding rails and the outer sliding rails can contract inwards to adapt to bonding pads of different models and types, the rails do not need to be replaced, and the cost is saved. The paster is capable of continuously and normally working the bonding pad. The vertical block is obliquely arranged, and the spring always exerts upward pulling force on the transverse rod, so that the elliptical block pokes the vertical block while the first motor drives the first circular plate and the elliptical block to rotate, the transverse rod at the left end is unlocked from the ratchet wheel, and the supporting rod rotates circumferentially; therefore, the bonding pad in the inner track can move towards the chip mounter, and the chip mounter can weld the bonding pad regularly and orderly.

Description

technical field [0001] The invention relates to the technical field of a cooling chip placement machine for intermittent transportation on a self-fixing track, in particular to a cooling chip placement machine for intermittent transportation on a self-fixing track. Background technique [0002] An integrated circuit is a kind of microelectronic device or component. It uses a certain process to interconnect components such as transistors, resistors, capacitors, inductors, and inductances required in a circuit, and make them in a small or several small pieces. A semiconductor wafer or a dielectric substrate, and then packaged in a package to become a microstructure with the required circuit functions; after the completion of the production, the pad needs to be cooled, so a self-fixed rail for intermittent transportation is required. Mounter. [0003] In the prior art, the cooling placement machine that is transported intermittently by the self-fixing track, its transmission t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/00H05K13/02H05K13/04
CPCH05K13/00H05K13/02H05K13/043H05K13/0465
Inventor 周创
Owner 周创
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products