Small pipe outer wall electroplating device

Abstract

The invention discloses a small pipe outer wall electroplating device. The device comprises an electroplating bath seat, a double-layer glass plating bath, an end cover, a base, a cathode lead-out unit, an anode and a plating piece. According to the small pipe outer wall electroplating device, electroplating operation on the outer wall of a tubular target piece aiming at actinide nuclide can be achieved, good electric field distribution is achieved, the solution amount is small, sealing operation can be conducted on a local area, solution temperature control in the electroplating process can be achieved, and the device is convenient to operate and adapts to the operation requirement of a glove box.

Description

technical field [0001] The invention belongs to the field of nuclear technology, in particular to the field of uranium target preparation, in particular to an electroplating device for the outer wall of a small tube. Background technique [0002] Uranium targets prepared by loading actinide materials such as uranium on a tubular substrate are widely used in the field of nuclear technology. At present, the electroplating method is the most common preparation method for uranium targets because of its simple equipment and convenient operation. Compared with the preparation of planar uranium targets, the difficulties in the preparation of tubular uranium targets are: 1) the electric field distribution of tubular uranium targets is difficult to control; 2) local masking is more difficult if the tubular uranium targets need to be electroplated in different areas. [0003] Usually, the electroplating of tubular targets is carried out in the following manner. A flat anode and a tar...

AI Technical Summary

Problems solved by technology

The disadvantages of this method are: 1) If the hanging type is not vertical, it is easy to cause a large deviation of the bottom during the rotation process, which will eventually cause unevenness of the plated parts

2) If local electroplating is required in this method, only tape masking and other methods can be used, and it is easy to fall off during the electroplating process

3) If this method wants to ensure the uniform distribution of the electric field in electroplating, the distance between the flat anode and the target needs to be large enough. Obviously, this will cause an increase in the amount of plating tank solution, which is not suitable for electroplating of precious raw materials such as actinide materials

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