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Thermal interface materials

A ceramic filler and composition technology, applied in the field of thermal interface materials, can solve problems such as short circuit, battery deformation, vehicle fire, etc.

Pending Publication Date: 2021-07-30
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] If the battery of an electric vehicle overheats, the battery may deform and an internal short circuit may develop
This could cause the vaporized battery gas to ignite or explode, potentially causing the vehicle to catch fire

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment B

[0057] The first part was prepared by mixing 98g of plasticizer, 3.5g of rheological additives, 63g of alumina filler with an average particle size of 0.3μm, 357g of alumina filler with an average particle size of 3μm, 630g of Aluminum filler, 1 gram of dibutyltin catalyst, and 1 gram of deionized water were added to a 0.6 gallon sized mixing bucket and mixed twice for 2 minutes at 800 rpm with a Flacktec DAC-5000 high speed mixer. The second part was prepared by mixing 46g of plasticizer, 50g of methoxysilane-terminated polyether, 4g of rheological additive, 2g of hindered phenolic antioxidant, 21g of alumina filler with an average particle size of 0.3μm, 399g Alumina filler with an average particle size of 3 μm, 630 g of alumina filler with an average particle size of 40 μm, and 2 g of water scavenger were added to a 0.6 gallon mixing bucket and stirred twice at 800 rpm with a Flacktec DAC-5000 high-speed mixer for 2 minute.

[0058] Examples B and C have different resin co...

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Abstract

A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volatile organic liquid is present in the composition in an amount greater than about 50wt.% based on the total weight of the silyl modified reactive polymer.

Description

Background technique [0001] Thermal interface materials are widely used in the electronics industry for coupling a heat source to a heat-sinking structure to help dissipate heat from the heat source. Typically, these thermal interface materials are used in heat generating electronic components. These thermal interface materials typically work by dissipating excess thermal energy generated by a heat source to a heat dissipation structure. [0002] Similar to electronics, electric vehicles are typically equipped with batteries that contain a plurality of battery cells that store electricity for powering the electric vehicle. These battery cells can be charged before use and recharged during driving by regenerative braking or the internal combustion engine. The battery cell may heat up during use, so a heat dissipation structure is required to prevent the battery cell from overheating. During charging, the chemical reactions that take place inside the battery generate heat; id...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/013C08K3/22C08L71/00C08G65/336C08G65/26C08J3/02C08J3/24H01M10/6551
CPCH01M2220/20H01M10/613H01M10/625H01M10/653C08K3/34C08K3/36C08L71/02C08G65/26C08G65/336C08K3/22C08K2003/2227C08K2201/014Y02E60/10C08K3/013C08L71/00C08G65/266C08G65/2687C08J3/02C08J3/24H01M10/6551H01M10/659C08K5/0016C08K5/005C08K5/57C08K2201/001C08K2201/005
Inventor C·吴J·蒂默曼R·切斯特菲尔德R·杰拉姆
Owner HENKEL KGAA
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