Preparation method and device of large array nanoneedle structure

Abstract

The invention discloses a method and device for preparing a large-area nano-needle structure, comprising: using tension gradients to drive micro-nano particles to form a large-area self-assembled structure at a liquid-gas interface, and transferring it to the surface of a silicon substrate. Oxygen reactive ion etching technology is used to adjust the particle diameter in the large-area self-assembled structure to form a non-closely arranged periodic micro-nano particle structure. The gold-plated layer was prepared on the surface of non-closely arranged periodic grain structure by electron beam evaporation. The particles are then removed by ultrasonic cleaning to form a periodic surface with alternately arranged gold-plated layers and silicon substrates. The substrate is placed in a hydrofluoric acid / hydrogen peroxide mixed solution for gold-catalyzed etching to form a nano-column structure. Finally, the nano-pillar structure was non-uniformly etched by sulfur hexafluoride reactive ion etching technology to form a large array nano-needle structure. The method has large preparation area, high preparation precision, strong shape controllability and high preparation stability.

Description

technical field [0001] The invention relates to the technical field of nanoneedle preparation, in particular to a method and device for preparing a large area array nanoneedle structure. Background technique [0002] Due to the "size effect" and other effects, the micro- and nano-needle structures have many unique characteristics in terms of light, electricity, magnetism, force, etc., and have gradually become a research hotspot. It has been widely used in interpretation and other fields. At present, photolithography, chemical etching, laser processing, and 3D printing technologies are common methods for preparing micro- and nano-needle structures. Among them, photolithography is a method of preparing micro- and nano-structures by using surface ultraviolet light masking materials, which is highly dependent on the preparation of high-precision mask plates, which is expensive and difficult to achieve large-scale preparation. Chemical etching is a method of preparing nanoneed...

AI Technical Summary

Problems solved by technology

Among them, photolithography is a method of preparing micro- and nano-structures by using surface ultraviolet light masking objects, which is highly dependent on the preparation of high-precision mask plates, which is expensive and difficult to achieve large-area preparation.

Chemical etching is a method of preparing nanoneedles by using chemical etchant to non-uniformly etch the substrate, but it is seriously affected by thermodynamics, the preparation is random, the shape of the nanoneedles cannot be precisely controlled, and the preparation accuracy is poor.

Laser processing and 3D printing technology have attracted much attention in the preparation of microneedle structures, but due to the limitation of their own processing precision, it is difficult to realize the preparation of nanometer-sized structures, and the processing process is very time-consuming, and it is difficult to achieve large-area preparation, thus limiting the nanoneedle structure. Wide application of structure

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