A RF Probe for Micropackaging Applications

Abstract

The invention discloses a radio frequency probe oriented to micro-encapsulation applications, and relates to the field of micro-encapsulation radio frequency technology. It includes a probe body, which includes a short-circuit waveguide, a dielectric substrate, and a waveguide transmission line; Including a short-circuit waveguide, a dielectric substrate, and a waveguide transmission line; the short-circuit waveguide is in the shape of a cube and has a first groove inside, and the thickness of the side circumference of the short-circuit waveguide is 0.3mm. The transmission lines are connected, and a second groove is opened inside the waveguide transmission line; metal through holes for radio frequency signal communication are evenly distributed on the dielectric substrate, and the metal through holes are electrically connected to the short-circuit waveguide and the waveguide transmission line, and the dielectric substrate and the waveguide transmission line are welded. The invention can realize a miniaturized waveguide-microstrip transition structure, and is easy to be integrated in a micro-encapsulation radio frequency system.

Description

technical field [0001] The invention relates to the field of micro-encapsulation radio frequency technology, in particular to a radio frequency probe oriented to micro-encapsulation applications. Background technique [0002] The transmission transition structure in the micro-encapsulation system of the waveguide-microstrip transition in the RF probe provides the function of converting electromagnetic waves from waveguide transmission to microstrip transmission. Its main value is to provide high-performance interfaces for micro-encapsulated solid-state circuits and external waveguide circuits. RF probes generally consist of waveguide transmission lines, short-circuit waveguides, and microstrip transmission lines. In the traditional RF probe structure, the short-circuit waveguide and the waveguide transmission line are generally on two metal cavities with similar thicknesses, and the two metal cavities are closed by screw locking to ensure that the signal does not leak. Ther...

AI Technical Summary

Problems solved by technology

[0003] Traditional radio frequency probes in the prior art are bulky and heavy, making it difficult to integrate with micro-encapsulation systems, and basically do not have the application capability of surface mount

Traditional RF probes do not have waveguide sealing capabilities. The circuit system using the traditional probe structure needs to withstand the pollution and corrosion of the external environment. In order to avoid the pollution and corrosion of the external environment, the circuit system needs to pay a higher cost and complex sealing design , making it difficult to widely engineer applications in modern micro-encapsulated radio frequency systems characterized by miniaturization and high integration

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