Adhesive-less substrate bonding to carrier plate

Abstract

Methods for bonding and de-bonding a thin substrate film to a carrier plate are provided herein. In some embodiments, a method of processing a semiconductor substrate includes applying a polymer layer that is non-adhesive to a carrier plate formed of a dielectric material. A second layer is then applied to the polymer layer. One or more redistribution layers are then formed on the second layer. The second layer is then separated from the carrier plate via at least one of magnetic induction heating, infrared exposure, or electrostatic repulsion.

Description

technical field [0001] Embodiments of the present principles generally relate to semiconductor processing used in packaging semiconductor devices. Background technique [0002] The semiconductor substrate is processed to form structures on the surface of the substrate. Structures on specific areas of the substrate can be linked together to form microcircuits. The substrate may have many different microcircuits constructed on the surface of the substrate during processing. Once processing of the substrate is complete, the substrate is cut or singulated to separate the microcircuits into semiconductor "chips" or dies. Substrates go through a lot of processing before developing the final chip. Some of these processes include physical vapor deposition (PVD), photolithography, and thermal curing. [0003] Chips often contain complex circuits that need to interact with external components. The chip's internal circuitry is too tiny to connect directly to external components. ...

AI Technical Summary

Problems solved by technology

However, temporary engagement and disengagement is expensive and time-consuming

Additionally, techniques using temporary carriers require additional processing steps, which increase cost and reduce yield for redistribution layer processing

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