Wafer end surface fine grinding device

Abstract

A wafer end surface fine grinding device, comprising: a support body, a support component, a feeding component, a transfer component, a transfer component and a fine grinding component. The feeding component is used to place multiple wafers and drive multiple wafers to move inward. The transfer component is used to clamp a single wafer located in the feeding component and drive the single wafer to move towards the transfer component. , the transfer assembly is used to hold the single wafer held by the transfer assembly, and drive the single wafer to the fine grinding assembly, and is used for turning over the single wafer, the fine grinding assembly is used for multiple wafers Round end faces fine ground. The invention facilitates the end face polishing operation of the wafer, facilitates the automatic feeding of the wafer, facilitates the automatic transfer of the wafer, facilitates the automatic flipping of the wafer, and facilitates the automatic flipping of the wafer during the end face polishing of the wafer. Automatic placement facilitates automatic wafer end face grinding and polishing operations, improves the automation of wafer end face polishing, and improves the efficiency and quality of wafer end face polishing.

Description

technical field [0001] The invention relates to the related technical field of chip preparation equipment, in particular to a wafer end surface fine grinding device. Background technique [0002] A chip is a general term for semiconductor component products. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of a semiconductor wafer. [0003] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. [0004] The main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. As semiconductor feature sizes become smaller and processing and measurement e...

AI Technical Summary

Problems solved by technology

[0006] The existing wafer end surface polishing device has a low degree of automation, so it is not easy to carry out dust-proof treatment during the polishing process of the wafer. On the one hand, intervention may affect the polishing effect of the wafer, on the other hand, it increases the work intensity of the operator and reduces the polishing efficiency

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