A
wafer end surface fine
grinding device, comprising: a support body, a support component, a feeding component, a transfer component, a transfer component and a fine
grinding component. The feeding component is used to place multiple wafers and drive multiple wafers to move inward. The transfer component is used to clamp a single
wafer located in the feeding component and drive the single
wafer to move towards the transfer component. , the transfer
assembly is used to hold the single wafer held by the transfer
assembly, and drive the single wafer to the fine
grinding assembly, and is used for turning over the single wafer, the fine grinding assembly is used for multiple wafers Round end faces fine ground. The invention facilitates the end face
polishing operation of the wafer, facilitates the automatic feeding of the wafer, facilitates the automatic transfer of the wafer, facilitates the automatic flipping of the wafer, and facilitates the automatic flipping of the wafer during the end face
polishing of the wafer. Automatic placement facilitates automatic wafer end face grinding and
polishing operations, improves the
automation of wafer end face polishing, and improves the efficiency and quality of wafer end face polishing.