Wafer bar end cutting device

Abstract

A wafer bar end cutting device, comprising: a support assembly, a first lifting assembly, a rear pulling mechanism, a second lifting mechanism, a clamping mechanism, an adjusting mechanism, an end cutting mechanism, a rotating mechanism and a rounding mechanism. The invention facilitates the automatic transfer of the wafer rod when processing the wafer rod, and can stably clamp the wafer rod when the wafer rod is transferred, thereby improving the safety of the wafer rod transfer , it is convenient to carry out the end cutting operation of the wafer bar, and at the same time, it can roughly grind the outer wall of the wafer plate. Through this device, the processing efficiency of the wafer bar can be significantly improved, and the working intensity of the operator can be reduced. It has a strong practicality.

Description

technical field [0001] The invention relates to the related technical field of wafer processing equipment, in particular to a wafer bar end cutting device. Background technique [0002] A chip is a general term for semiconductor component products. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of a semiconductor wafer. [0003] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. [0004] The main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. As semiconductor feature sizes become smaller and processing and measurement equipment b...

AI Technical Summary

Problems solved by technology

[0007] The existing device transfers the bar to the cutting device by manual handling when cutting both ends of the bar, and then cuts the end through the cutting device. After the cutting is completed, the bar is transferred to the corresponding coarse grinding device. Carry out rough grinding of the outer wall of the bar. This operation method has a low degree of automation in wafer bar processing, and the operator's work intensity is high, and the processing efficiency of the bar is low.

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