Wafer bar end cutting device

Abstract

A wafer bar end cutting device comprises a supporting assembly, a first lifting assembly, backward pulling mechanisms, second lifting mechanisms, clamping mechanisms, adjusting mechanisms, end cutting mechanisms, rotating mechanisms and rounding mechanisms. When a wafer bar is machined by the wafer bar end cutting device, automatic transfer of the wafer bar is convenient, when the wafer bar is transferred, the wafer bar can be stably clamped, the transfer safety of the wafer bar is improved, end cutting operation of the wafer bar is facilitated, and meanwhile, the outer wall of the wafer bar can be coarsely ground; and by means of the wafer bar end cutting device, the machining efficiency of the wafer bar can be remarkably improved, the working intensity of operators is lowered, and the device has high practicability.

Description

technical field [0001] The invention relates to the related technical field of wafer processing equipment, in particular to a wafer bar end cutting device. Background technique [0002] A chip is a general term for semiconductor component products. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of a semiconductor wafer. [0003] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. [0004] The main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. As semiconductor feature sizes become smaller and processing and measurement equipment b...

AI Technical Summary

Problems solved by technology

[0007] The existing device transfers the bar to the cutting device by manual handling when cutting both ends of the bar, and then cuts the end through the cutting device. After the cutting is completed, the bar is transferred to the corresponding coarse grinding device. Carry out rough grinding of the outer wall of the bar. This operation method has a low degree of automation in wafer bar processing, and the operator's work intensity is high, and the processing efficiency of the bar is low.

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