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Light-emitting chip module, its preparation method, array substrate and display panel

A technology for light-emitting chips and array substrates, which is applied in the fields of preparation methods, light-emitting chip modules, array substrates, and display panels, can solve problems such as unstable reliability of color transfer layers, and achieve improved effectiveness and stability, and increased Effect of Luminous Intensity

Active Publication Date: 2022-12-02
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the main purposes of this application is to solve the problem of unstable reliability of the existing color transfer layer, and provide a light-emitting chip module, its preparation method, array substrate and display panel

Method used

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  • Light-emitting chip module, its preparation method, array substrate and display panel
  • Light-emitting chip module, its preparation method, array substrate and display panel
  • Light-emitting chip module, its preparation method, array substrate and display panel

Examples

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no. 1 example

[0069] Figure 3A It is a flow chart of the first part of the preparation steps of the light-emitting chip module preparation method shown in the first embodiment, Figure 3B It is a flowchart of the second part of the preparation steps of the light-emitting chip module preparation method shown in the first embodiment, Figure 3C It is a flowchart of the third part of the preparation steps of the light-emitting chip module preparation method shown in the first embodiment, Figure 3D It is a flowchart of the preparation steps of the fourth part of the light-emitting chip module preparation method shown according to the first embodiment.

[0070] The method for preparing a gallium nitride-based light-emitting diode light-emitting chip module shown in the first embodiment is mainly characterized in that after the chip light-emitting layer is formed, the protective layer 3 is peeled off first, and then the color transfer layer is prepared on the buffer layer to complete the color...

no. 5 example

[0115] Figure 7A is a flowchart of the third part of the preparation steps of the light-emitting chip module preparation method shown according to the fifth embodiment, and Figure 7B It is a flowchart of the fourth part of the preparation steps of the light-emitting chip module preparation method shown according to the fifth embodiment.

[0116] The preparation method of the fifth embodiment is basically the same as the first two parts of the preparation steps a-g of the preparation method of the fourth embodiment, so it will not be repeated. The main difference between the preparation method of the fifth embodiment and the preparation method of the fourth embodiment is that the first The preparation method of the fifth embodiment comprises the following steps:

[0117] h. Dig a hole in the gallium nitride (GaN) buffer layer 2, first transfer the chip to the temporary substrate 8, and form a temporary flat layer 7 between the temporary substrate 8 and the pad 9; the tempora...

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Abstract

The present application relates to the field of display technology, and discloses a light-emitting chip module, a preparation method thereof, an array substrate, and a display panel. The light-emitting chip module includes a light-emitting layer, a buffer layer, and a protective layer arranged in sequence. There are a plurality of light-emitting units in the light-emitting layer, and the buffer layer or the protective layer includes a plurality of holes, and the holes are respectively aligned Each of the light-emitting units in the light-emitting layer is filled with an optical unit in the hole, and each of the light-emitting units emits light toward the protective layer through the corresponding optical unit. Light is scattered from its optical center to the periphery. The embodiment of the present application can fully guarantee the reliability of the color transfer layer under the premise of maintaining the output performance.

Description

technical field [0001] The present application relates to the field of display technology, in particular, to a light-emitting chip module, its preparation method, an array substrate and a display panel. Background technique [0002] A light-emitting diode (Light-Emitting Diode, LED) display technology is a display technology based on LEDs forming pixel units. In LED display technology, organic light-emitting diodes (OLEDs) are more and more widely used in display fields such as mobile phones, tablet computers, and digital cameras. In addition, small-pitch LEDs, mini LEDs (Mini LEDs) and micro LEDs (Micro LEDs) ), quantum dot light-emitting diodes (QLED), etc. also have good market prospects in the display field, and thus are increasingly valued by the industry. [0003] With the rise of the OLED industry, thin modules and high color gamut requirements have had a huge impact on the traditional LCD industry. In order to meet the challenges of OLEDs, Mini LEDs emerged as the t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/44H01L33/50H01L27/15
CPCH01L33/44H01L33/507H01L27/156H01L2933/0091H01L2933/0041H01L2933/0025
Inventor 李翔舒适何伟于勇徐传祥岳阳邹浩伟李伟姚琪黄海涛
Owner BOE TECH GRP CO LTD