Topological optimization method and system for electronic wire harness

Abstract

The invention provides a topological optimization method and system for an electronic wire harness. The method comprises the following steps: acquiring a continuous entity model and material parameters of an insulation protection layer; determining a design area, and performing grid segmentation on the continuous entity model according to the design area to obtain a grid model; based on the grid model, establishing a topological optimization model which takes the lowest material cost of an insulation protection layer as an objective function, takes open distribution of the first insulation material and / or the second insulation material as design variables, and takes insulation strength, aging speed and mechanical properties as constraint conditions; and performing optimization updating of design variables on the topological optimization model according to finite element analysis, and iterating until the topological optimization model meets a convergence condition to obtain optimized design variables. The use amount of the insulation materials can be reduced, and the service lifetime of the electronic wire harness is prolonged.

Description

technical field [0001] The invention relates to the field of electronic wiring harnesses, in particular to a topology optimization method and system for electronic wiring harnesses. Background technique [0002] A wiring harness is a group of wires and cables bound together to carry the signal and power connections to and from devices. For wire harnesses with multiple wires, in order to ensure the degree of forming and reduce the shape, it is generally necessary to twist the wires. Due to the large pitch diameter of the stranding system, most of them adopt the non-back twisting method, so that the wires are tightly twisted together. Twisting the core wires together in this way will change the physical properties of the core wires. For example, due to the twisting of the insulating layer on the surface of the wire, a certain stress concentration phenomenon on the surface will occur and last for a long time, which will reduce the physical properties of the insulating layer and...

AI Technical Summary

Problems solved by technology

Twisting the core wires together in this way will change the physical properties of the core wires. For example, due to the twisting of the insulating layer on the surface of the wire, a certain stress concentration phenomenon on the surface will occur and last for a long time, which will reduce the physical properties of the insulating layer and make it easier Ageing

And some other ways are to integrate the insulation layer of multiple wires, but in this way, there will be redundancy of materials and the cost will increase

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