Manufacturing process of heat-conducting circuit board

A manufacturing process and circuit board technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems that heat cannot be transferred quickly, does not have efficient heat conduction function, etc., and achieves good thermal conductivity and bending resistance safety features , meet the equipment requirements, the effect of good thermal conductivity

Active Publication Date: 2021-08-20
ZHUHAI KINGROAD ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the printed circuit boards used in servo systems are generally made of FR4 circuit boards or ordinary metal substrates, which do not have efficient heat conduction function, and the heat generated by the servo motor for a long time cannot be transferred quickly.

Method used

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  • Manufacturing process of heat-conducting circuit board
  • Manufacturing process of heat-conducting circuit board
  • Manufacturing process of heat-conducting circuit board

Examples

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Embodiment Construction

[0023] Embodiments of the present invention will be described in detail below, and examples of this embodiment are illustrated in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The following is exemplary, and is intended to be used herein, not to be construed as limiting the invention.

[0024] In the description of the present invention, it is to be understood that, it is related to orientation, such as "upper", "lower", "front", "left", "right", "vertical", "horizontal" , "Top", "Bottom", "Inner", "Out", "Axial", "Radial", "Wentry", "Surrounding", etc. The orientation or location relationship is based on the drawing. The orientation or positional relationship shown is intended to facilitate the description of the present invention and simplified description, rather than indicating or implying that the device or component must have a specific orientation, and therefore cannot b...

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PUM

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Abstract

In order to solve the problem of poor heat conduction capability of a circuit board in the field of printed circuits, the invention provides a manufacturing process of a heat-conducting circuit board. The process comprises the steps of first pressing, first processing, second pressing, first drilling, first electroless plating copper thickening, second processing, third pressing, second drilling, second electroless plating copper thickening, third processing and fourth pressing. And finally, the heat-conducting circuit board with a nine-layer structure including a first copper foil layer, a first insulating layer, a second copper foil layer, a second insulating layer, a third copper foil layer, a third insulating layer, a fourth copper foil layer, a fourth insulating layer and an aluminum base layer is formed. According to the manufacturing process of the heat-conducting circuit board, the heat-conducting circuit board is formed by laminating the multiple layers of heat-conducting resin and the aluminum-based material, heat generated by long-time work of equipment can be quickly transferred, and the heat-conducting capacity is good; and multiple layers are electrically connected through a first heat conduction hole and a second conduction hole after being mixed and pressed, so that complex circuit wiring can be accommodated.

Description

Technical field [0001] The present invention relates to the field of printed circuits, and more particularly to a manufacturing process of a thermally conductive circuit board. Background technique [0002] The printed circuit board currently applied to the servo system is generally made of a circuit board or a common metal substrate of FR4. It does not have high efficiency thermal conductive function, and the heat generated by the servo motor for a long time of the servo motor cannot be transferred quickly. Inventive content [0003] The present invention is intended to address at least one of the technical problems present in the prior art. To this end, the present invention proposes a manufacturing process of a thermally conductive circuit board, which can be pressed into a circuit board with a thermally conductive resin and an aluminum-based material, which can quickly transfer the heat generated by the device for long-term operation of the circuit board, Has good thermal co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H05K3/40H05K1/02
CPCH05K3/4644H05K3/42H05K3/40H05K1/0207
Inventor 徐建华刘桂武李敏尹航
Owner ZHUHAI KINGROAD ELECTRONICS
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