In order to solve the problem of poor heat conduction capability of a circuit board in the field of printed circuits, the invention provides a manufacturing process of a heat-conducting circuit board. The process comprises the steps of first pressing, first processing, second pressing, first drilling, first electroless plating copper thickening, second processing, third pressing, second drilling, second electroless plating copper thickening, third processing and fourth pressing. And finally, the heat-conducting circuit board with a nine-layer structure including a first copper foil layer, a first insulating layer, a second copper foil layer, a second insulating layer, a third copper foil layer, a third insulating layer, a fourth copper foil layer, a fourth insulating layer and an aluminum base layer is formed. According to the manufacturing process of the heat-conducting circuit board, the heat-conducting circuit board is formed by laminating the multiple layers of heat-conducting resin and the aluminum-based material, heat generated by long-time work of equipment can be quickly transferred, and the heat-conducting capacity is good; and multiple layers are electrically connected through a first heat conduction hole and a second conduction hole after being mixed and pressed, so that complex circuit wiring can be accommodated.