Integrally packaged micro-display chip and preparation method thereof

Abstract

The invention relates to an integrated packaging micro display chip, and the chip is characterized in that the chip comprises a substrate, a blue light Micro-LED sub-pixel, a red light Micro-OLED or Micro-QLED sub-pixel and a red light Micro-OLED or Micro-QLED sub-pixel; an n electrode of the Micro-LED sub-pixel is connected with one electrode of the Micro-OLED or the Micro-QLED, and a p electrode of the Micro-LED sub-pixel, the other electrode of the red light Micro-OLED or the Micro-QLED and the other electrode of the green light Micro-OLED or the Micro-QLED are respectively led out to form four leading-out electrodes of the integrated packaging micro-display chip. According to the invention, a blue light Micro-LED sub-pixel, a red light Micro-OLED or Micro-QLED sub-pixel, and a green light Micro-OLED or Micro-QLED sub-pixel are combined, and a micro-display pixel chip with a larger size and controllable luminescence of three primary colors is formed through wafer-level integration and packaging.

Description

technical field [0001] The invention relates to the field of photoelectric display technology, in particular to an integrated packaging micro-display chip and a preparation method thereof. Background technique [0002] Modern society has entered into informationization and is developing in the direction of intelligence. Display is the key link to realize information exchange and intelligence. Among the current display technologies, Micro-LED display technology is considered to be a disruptive next-generation display technology. Micro-LED display technology is a self-luminous display technology that integrates arrayed micron-scale LED light-emitting devices (μLEDs) on an active addressable drive substrate to achieve individual control and lighting to output display images. Micro-LED has the advantages of low power consumption (power consumption is only one-tenth of that of LCD), high brightness, high color saturation, high response speed, long life and high efficiency, and i...

AI Technical Summary

Problems solved by technology

[0003] However, Micro-LED still has some technical difficulties

1) First, it is very difficult to grow RGB three-color Micro-LEDs with different wavelengths on the same substrate

This method needs to precisely align each sub-pixel and drive RGB three colors separately, the driving circuit is complicated and the cost is extremely high; 2) Secondly, the size of Micro-LED is below 50um, which is not compatible with traditional display panel technology , For example, in terms of electrical measurement, the cost of Micro-LED EL test method is more than 20 times higher than the existing mature EL test method of 100um or more; 3) Again, Micro-LED needs to be transferred into Hundreds of millions of LED chips, and require a yield rate of over 99.9999%

However, the current small-size mass transfer technology cannot meet such yield requirements, resulting in the high cost of Micro-LED, which cannot be quickly promoted.

Images