Micro device transfer device and transfer method

A micro-device transfer and micro-device technology, which is applied in the manufacturing of electric solid-state devices, semiconductor devices, and semiconductor/solid-state devices, etc. uniform effect

Active Publication Date: 2021-09-24
JIHUA LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to propose a micro-device transfer device and transfer method, aiming to solve the technical problem that the transfer yield of the existing stamp-type mass transfer method cannot be improved

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  • Micro device transfer device and transfer method
  • Micro device transfer device and transfer method

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0036] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the relationship between the components in a certain posture. If the specific posture changes, the directional indication will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second" and so on in the...

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Abstract

The invention discloses a micro device transfer device and a transfer method, the transfer device comprises a control module, a supply substrate and transfer heads, a first side surface of the supply substrate is provided with a plurality of rows of transfer heads, the first side surface of the supply substrate is a curved surface bent towards the direction of the supply substrate, and the control module is used for controlling the plurality of rows of transfer heads to adsorb and release the micro devices so as to transfer the micro devices. According to the invention, the micro devices on the plurality of columns of transfer heads are in contact with the receiving substrate in sequence by rotating the supply substrate, and the plurality of columns of transfer heads are controlled by the control module to release the micro devices in sequence, so that the micro devices on the plurality of columns of transfer heads are transferred in sequence. The micro devices are transferred in batches and rows. Therefore, the transfer yield of the mass transfer mode of the micro devices is effectively improved, and the generation efficiency of the micro devices is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a micro-device transfer device and a transfer method. Background technique [0002] At present, the mass transfer technology of micro-LEDs is mainly divided into stamp transfer, laser transfer, fluid self-assembly and roller transfer. Among them, the stamp type needs a special transfer head to realize the pick-up and transfer of micro-LEDs. These transfer heads can use the principles of Van der Waals force, magnetic force, electrostatic adsorption or vacuum adsorption. Laser transfer utilizes specific wavelength laser to irradiate the sacrificial layer to realize the peeling of the micro light-emitting diode and the sapphire substrate, thereby realizing the transfer. Fluidic self-assembly uses the drag force of the fluid to transfer the micro-LEDs to the backplane. Roller transfer printing uses soft roller stamps to transfer micro-LEDs and thin-film transistors (TFT for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L21/683H01L21/67
CPCH01L33/48H01L21/6835H01L21/67253H01L2933/0033H01L2221/68363H01L2224/95001
Inventor 李义徐成梁振廷秦燕亮安宁王玉田德天陈培培
Owner JIHUA LAB
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