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Welding device and welding method for printed board assembly based on inter-board vertical interconnection

A technology of welding device and welding method, which is applied in the direction of welding equipment, printed circuit manufacturing, manufacturing tools, etc., can solve the problem of floating height and warping deformation of printed boards, position deviation of surface-mounted connectors on printed boards, connectors Problems such as inclination can be solved to achieve the effect of reducing external stress, improving high reliability and ensuring reliability

Active Publication Date: 2021-08-27
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a printed board component welding device and its welding method based on the vertical interconnection between boards in view of the above-mentioned problems, so as to solve the problem of positional deviation of the surface mount connector on the printed board, Problems such as connector tilt, floating height and printed board warpage, so as to improve the realizability and reliability of vertical interconnection between boards

Method used

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  • Welding device and welding method for printed board assembly based on inter-board vertical interconnection
  • Welding device and welding method for printed board assembly based on inter-board vertical interconnection
  • Welding device and welding method for printed board assembly based on inter-board vertical interconnection

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Embodiment 1

[0059] This embodiment provides a welding device based on vertically interconnected printed board assemblies between boards, the welding device is used for such as figure 1 The welding of the vertically interconnected printed board assembly between the boards shown, the vertically interconnected printed board assembly between the boards includes two printed board assemblies containing radio frequency surface mount connectors and KK heads for interconnection and transfer, such as figure 2 and image 3 As shown, the printed board assembly contains multiple RF surface mount connectors, pin holes, screw mounting holes and other components.

[0060] like Figure 4 As shown, a welding device based on the vertically interconnected printed board assembly provided by this embodiment includes a positioning plate 1 and a supporting plate 2, and is used to realize the positioning between the positioning plate, the printed board assembly, and the supporting plate. The pin 3 and the scre...

Embodiment 2

[0098] This embodiment is basically the same as Embodiment 1, the difference is that in this embodiment, surface mount connectors are to be welded on both sides of the printed board assembly, so the welding method provided in this embodiment is the same as that provided in Embodiment 1. On the basis of method steps 1-5, it also includes:

[0099] S6, fixing the surface mount connector by dispensing glue.

[0100] like Figure 11 As shown, after the first side of the printed board assembly is soldered, fix all surface-mount connectors with Loctite 3619 glue at symmetrical points, and bake at 125°C for 15 minutes to prevent the surface-mount connectors from falling off during reflow soldering on the second side of the printed board. and position offset.

[0101] S7, repeat S2-S5, and complete the soldering of the surface mount connector on the second side of the printed board.

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Abstract

The invention relates to the technical field of electronic equipment, and discloses a welding device and welding method for a printed board assembly based on inter-board vertical interconnection. The welding device comprises a positioning plate, a supporting plate, pins and screws, wherein the positioning plate is arranged above a printed board, the supporting plate is arranged below the printed board, the positioning plate, the supporting plate and the printed board are positioned through the pins, and the positioning plate, the supporting plate and the printed board are fixed together through the screws. According to the welding device and welding method, the welding device is adopted to mount and position a surface-mounted connector on the printed board assembly, the buckling deformation of the printed board in the welding process is controlled, accurate positioning and reliable welding of the surface-mounted connector based on inter-board vertical interconnection are realized, the problems of the position offset of the surface-mounted connector on the printed board assembly, the inclination and flotation of the connector and the buckling deformation of the printed board can be solved, and therefore the realizability and reliability of inter-board vertical interconnection are improved.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to the field of electrical interconnection of printed board components, in particular to a welding device and a welding method based on vertically interconnected printed board components between boards. Background technique [0002] Low-frequency and high-frequency signal transmission between printed board components is generally connected through cable components, through-hole plug-in connectors or insulators. However, as the number of vertically interconnected signals between printed board components increases, the traditional vertically interconnected structure has problems such as large volume, complicated assembly, and high cost. In this case, the structure of vertical interconnection between boards using surface mount connectors came into being. This multi-layer vertical interconnection structure has the advantages of small size, high interconnection density, cable-free, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/008B23K1/20H05K3/34
CPCB23K1/0008B23K1/008B23K1/20B23K1/203H05K3/3494
Inventor 张涛胡雅婷周凤龙李竹影陈雨李亮常义宽李立周俊黄福清向华
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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