A piezoelectric acoustic transducer with filtering function and its manufacturing method
An acoustic transducer and piezoelectric technology, applied in piezoelectric/electrostrictive transducer microphones, microphones, sensors, etc., can solve the problems of poor sound pickup effect and improve the sound pickup quality
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Embodiment 1
[0048] Embodiment 1 provides a piezoelectric acoustic transducer with filtering effect, see Figure 9 , the diaphragm 52 adopts a cantilever beam structure with a fixed center, and the center fixed end of the diaphragm 52 is established on the filter layer 56 .
[0049] The filter layer 56 includes a support column 57 , the support column 57 serves as a support for the diaphragm 52 , and the filter layer 56 defines the through hole 53 in a region outside the support column 57 . The diaphragm 52 can be divided into a plurality of diaphragms.
Embodiment 2
[0051] The diaphragm 52 adopts a cantilever beam structure with an outer periphery fixed, and the outer periphery fixed end of the diaphragm 52 is established on the substrate 51, such as image 3 shown. The diaphragm 52 can be divided into a plurality of diaphragms.
Embodiment 3
[0053] Embodiment 3 provides a method for manufacturing a piezoelectric acoustic transducer with filtering effect as described in Embodiment 1 or Embodiment 2, specifically a method for manufacturing a MEMS chip, including the following steps:
[0054] Step 1. Select a silicon wafer as the first insulating layer 513, and form a cavity structure on the silicon wafer through photolithography and etching processes;
[0055] Step 2, deposit silicon dioxide 541 in the cavity structure, and use chemical mechanical polishing process to grind the surface flat; see Figure 5 (corresponding to embodiment 2), Figure 11 (corresponding to embodiment 1);
[0056] Step 3, bonding a composite layer consisting of a transition layer 512 and a second insulating layer 511 on the silicon wafer with the cavity structure;
[0057] Step 4. Deposit materials in sequence on the composite layer to form a structural layer, and the structural layer is used as the diaphragm 52; see Image 6 (correspond...
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