Wafer boat, diffusion equipment and semiconductor device manufacturing method

Abstract

The invention discloses a wafer boat, diffusion equipment and a semiconductor device manufacturing method. The wafer boat comprises a plurality of fixing columns, fixing plates, connecting tables and bearing structures. The fixing plates are connected with the plurality of fixing columns. The connecting tables are provided with first detachable parts. The plurality of bearing structures are arranged on the fixing columns, the plurality of fixing columns jointly bear wafers through the corresponding bearing structures on the fixing columns, and the wafers comprise product wafers and control wafers. Each bearing structure comprises a product bearing part, a control wafer bearing part and a connecting table bearing part, wherein the product bearing part is used for bearing a product wafer, the control wafer bearing part is used for bearing a control wafer, the connecting table bearing part is arranged above the control wafer bearing part, and the connecting table bearing part is provided with a second detachable part. The second detachable parts and the first detachable parts are correspondingly arranged and detachably connected, so that the connecting tables can be relatively and fixedly installed on the connecting table bearing parts. According to the invention, through the above mode, the applicability of the wafer boat is improved.

Description

technical field [0001] The present application relates to the field of semiconductor technology, in particular to a crystal boat, diffusion equipment and a manufacturing method of a semiconductor device Background technique [0002] Polysilicon plays a very important role in the semiconductor field and is mainly used as a gate material. The minimum line width usually referred to refers to the width of polysilicon. Therefore, the growth of the silicon gate determines the performance of the entire semiconductor device. The manufacturing conditions, spacing and shape of the crystal boat also affect the growth of polysilicon. In the actual production process, because the reaction of polysilicon is the thermal decomposition of silane, the polysilicon is deposited on the surface of the wafer, and the surface of the wafer is flat. The product is in the shape of an isolation slot filler, which leads to the specific surface area of ​​the product being larger than that of the control...

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Problems solved by technology

As a result of this measurement, the particle status of the 6 control tablets is used as a reference, and the thickness is mainly based on the lower layer, which brings a disadvantage that 3 control tablets are wasted every time production is carried out; use a fixed connection table instead of not used for testing Although the control of the thickness status saves costs, when the number of actual loaded product wafers changes, the fixed connection table cannot adjust the position, resulting in waste of space in the wafer boat, and prone to wafer measurement results in the wafer boat inaccurate question

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