Processing technology of single-layer wireless charging coil carrier plate

A technology of wireless charging and processing technology, applied in coil manufacturing, circuits, electrical components, etc., can solve problems such as application and implementation of wireless charging coil carrier boards

Pending Publication Date: 2021-09-10
JIANGSU PROVISION ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the single-layer wireless charging coils on the market are made by winding wires wrapped in insulating layers or by FPC technology; and the existing PCB technology has no application implementation on the carrier board of wireless charging coils.

Method used

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  • Processing technology of single-layer wireless charging coil carrier plate
  • Processing technology of single-layer wireless charging coil carrier plate
  • Processing technology of single-layer wireless charging coil carrier plate

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Embodiment

[0033] The processing technology of the single-layer wireless charging coil carrier plate according to the present invention comprises the following steps:

[0034] S1), see attached figure 1 As shown, a carrier board B0 is prepared, the carrier board B0 has an auxiliary substrate 10 and two ultra-thin carrier copper foils 11, each of the two ultra-thin carrier copper foils 11 has a layer of carrier copper foil 110 and a The ultra-thin copper foil 111 is detachably arranged on one surface of the carrier copper foil 110, and the two ultra-thin carrier copper foils 11 are respectively pressed by the carrier copper foil 110 on them. fit on the front and back sides of the auxiliary substrate 10;

[0035] S2), paste dry films on the two ultra-thin copper foils 111 respectively, and form circuit patterns after exposure and development. For details, please refer to the attached figure 2 shown; in addition, the thickness of the dry film will be slightly greater than the thickness o...

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Abstract

The invention discloses a processing technology of a single-layer wireless charging coil carrier plate. The processing technology comprises the following steps: preparing a carrier plate provided with an auxiliary substrate and two ultrathin carrier copper foils, wherein the two two ultrathin carrier copper foils are respectively laminated on the front surface and the back surface of the auxiliary substrate, and are respectively provided with a carrier copper foil and an ultrathin copper foil detachably arranged on one surface of the carrier copper foil; pasting dry films on the two ultrathin copper foils, and forming a circuit pattern after exposure and development; electroplating circuit copper layers on the two ultrathin copper foils according to the circuit pattern, then removing the dry films, and printing resin layers on the two circuit copper layers to obtain a second intermediate plate; splitting the second intermediate plate along the joint of the two ultrathin copper foils and the two carrier copper foils to obtain two third intermediate plates; and etching off the ultrathin copper foils on the third intermediate plates to obtain an effective plate of the single-layer wireless charging coil carrier plate. According to the invention, the processing technology is novel and high in production efficiency, the thickness of the manufactured single-layer wireless charging coil carrier plate is small, the reliability is good, and the coil pattern shape and wiring are not limited.

Description

technical field [0001] The invention relates to the technical field of wireless charging coil manufacturing, and specifically provides a processing technology for a single-layer wireless charging coil carrier board. Background technique [0002] With the continuous advancement of science and technology and the continuous upgrading of human needs, electronic products such as mobile phones and tablet computers are constantly being updated and upgraded, and wireless charging is becoming more and more a trend, causing more market demand. [0003] At present, the single-layer wireless charging coils on the market are mostly made of wires wrapped with insulating layers or made by FPC technology; and the existing PCB technology has no application implementation on the carrier board of the wireless charging coil. [0004] In view of this, the present invention is proposed. Contents of the invention [0005] In order to overcome the above-mentioned defects, the present invention p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/04
CPCH01F41/041
Inventor 马洪伟宗芯如杨飞
Owner JIANGSU PROVISION ELECTRONICS CO LTD
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