Plasma degumming method for mixed-pressed circuit board

Abstract

The invention discloses a plasma degumming method for a mixed-pressed circuit board. The method comprises the steps of: carrying out primary plasma degumming on a laminated board which is obtained through the mixed pressing of two materials with different degumming difficulties and a via hole through machining, forming a copper protection layer on the hole wall corresponding to the material with small degumming difficulty according to the polarity difference of the two materials, wherein a copper protection layer is not formed on the hole wall corresponding to the material with high degumming difficulty, then carrying out secondary plasma degumming, removing the copper protection layer, and completing copper deposition and electroplating coordinated with chemical degumming. Therefore, selective degumming be carried out on different types of materials, various quality abnormities can be effectively avoided, and a good degumming effect and a good metallization effect are ensured.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a plasma deglue method for mixed-pressure circuit boards. Background technique [0002] 5G Network (5G Network) is the abbreviation of the fifth-generation mobile communication network, which is an extension of the 4G network. Compared with the 4G network, the biggest feature of the 5G network is high speed, low loss, and low delay. The network has put forward higher requirements for PCB (Printed Circuit Board), that is, high-frequency boards with low loss, stable Dk (dielectric constant) / Df (dielectric loss), and high temperature resistance must be selected to meet The above requirements and the most commonly used is PTFE substrate. [0003] At present, due to the relatively expensive price of high-frequency boards, end customers often use mixed-voltage laminated designs from the perspective of cost savings, and high-frequency copper-clad laminates with PTFE / cera...

AI Technical Summary

Problems solved by technology

In the prior art, plasma degumming or chemical degumming is generally used for degumming. In the process of degumming, a single degumming parameter often cannot match the desmearing effect of the two materials at the same time.

For example, when the degumming parameters of the easy-to-remove materials are selected, it is easy to cause incomplete degumming of the pore wall of the difficult-to-remove materials.

In addition, due to the difference in the characteristics of mixed-pressed materials, the range of available degumming parameters is often very narrow, or even no suitable parameters

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