Activating solution before chemical nickel plating based on ruthenium system and preparation method of activating solution

Abstract

The invention discloses an activation solution before chemical nickel plating based on a ruthenium system and a preparation method of the activation solution. The activation solution comprises the following raw materials in mass concentration: 100-300 mg / L of ruthenium salt, 10000-20000 mg / L of concentrated sulfuric acid, 100-400 mg / L of a complexing agent, 10-30 mg / L of a stabilizer, 20-40 mg / L of a surfactant and 30-50 mg / L of a dispersing agent. According to the activating solution, surface treatment of chemical nickel can be achieved on a line with the line width / line distance being 2 mil / 2 mil or below, diffusion plating of an existing nickel plating process is improved, quality abnormity such as hole gold plating is solved, the copper ion tolerance of a bath solution is improved, the copper ion tolerance can be maximally improved to 200 ppm, the service life of the bath solution of the activating solution is longer, 20-30 m < 2 > of plates can be treated by each liter of bath solution, and the service life of the plates is prolonged. The activation of the ruthenium system can catalyze the chemical nickel plating of various substrates, and the binding force of the plating layer is excellent.

Description

technical field [0001] The invention relates to the technical field of activation solution, in particular to a ruthenium system-based activation solution before electroless nickel plating and a preparation method thereof. Background technique [0002] At present, domestic patents for ion-free ruthenium catalyzed chemical nickel have no detailed records, and there is no mature application technology in this area. At present, the palladium sulfate or palladium chloride is the all-palladium system of palladium salt used in the catalysis of chemical nickel in the industry. The replacement of copper and palladium ions forms a palladium catalytic layer, which catalyzes chemical nickel and becomes a catalyst for chemical nickel plating on a copper substrate. Plating, gold on NPTH holes, etc. [0003] There are few domestic patent documents on ionic ruthenium catalysis, and there are records of organic ruthenium complexes as organic catalytic synthesis intermediates; [0004] For ...

AI Technical Summary

Problems solved by technology

[0006] 1. The existing palladium activation solution of chemical nickel cannot handle graphics with a line width / spacing below 2mil / 2mil, and IC carrier-level circuits are even more impossible to realize;

[0007] 2. Palladium activation is prone to seepage and missing plating;

[0008] 3. The copper ion tolerance is lower than 120ppm, and only 10-15m per liter of bath solution can be treated 2 the plate;

[0009] 4. The activator of the palladium system is only suitable for the catalysis of copper substrates. For aluminum-based, metal-doped ceramic substrates, etc., the catalytic layer will be loose and peeled after nickel plating.

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