Low-temperature nickel plating solution, nickel plating technology, flexible nickel plating layer and flexible printed circuit board

Abstract

The invention provides a low-temperature nickel plating solution. The low-temperature nickel plating solution comprises a nickel salt and a composition only containing a nonmetal element, the contentof the nickel salt (by Ni<2+>) in the low-temperature nickel plating solution is 4.0-8.0 g / L, and the composition only containing the nonmetal element includes 10-50 g / L of a reducing agent, 20-100 g / L of a complexing agent, 0.0001-0.5 g / L of a stabilizer and 0.001-1 g / L of a promoter. The nickel plating solution only contains ions of only one element nickel, so environmental protection and low energy consumption are achieved; and the low-temperature nickel plating solution is applied to a flexible circuit substrate at 80 DEG C or below to form a flexible nickel plating layer, and the flexiblenickel plating layer is cylindrical, has good flexural strength, and well improves diffusion coating, skip plating and color difference phenomena. The invention also provides a low-temperature nickelplating technology based on the low-temperature nickel plating solution, the flexible nickel plating layer produced by using the technology, and a flexible printed circuit board containing the flexible nickel plating layer.

Description

technical field [0001] The invention relates to the technical field of chemical nickel plating, in particular to a low-temperature nickel plating process for flexible printed circuit boards, a low-temperature nickel plating solution for the low-temperature nickel plating process, and a flexible nickel plating layer completed by the above-mentioned nickel plating process, and includes the flexible nickel plating process. Nickel-plated flexible printed circuit board. Background technique [0002] With the rapid development of smart wearable flexible electronics, the demand and application of flexible printed circuit boards (Flexible Printed Circuit (FPC), hereinafter referred to as flexible boards) are becoming more and more extensive. Especially because of its light and thin, flexible, low voltage, low power consumption and other characteristics, it is widely used in electronic products such as notebook computers, liquid crystal displays, hard disks, and printers. However, w...

AI Technical Summary

Problems solved by technology

[0008] In summary, the existing methods have the following defects: 1. Most of the formed nickel coatings are laminar, with large stress and poor bending resistance; 2. Many nickel plating solutions contain multiple heavy metal ions, 3. The plating temperature needs to be carried out at high temperature, that is, the temperature needs to be above 80°C; 4. The difference in the thickness of the nickel coating obtained by the existing method on the large and small copper surfaces can reach more than 25% at most , the nickel plating layer is prone to be too thick or too thin;

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