Czochralski single crystal charging method
A single crystal and charging technology, which is applied in the directions of single crystal growth, single crystal growth, and polycrystalline material growth, etc., can solve problems such as furnace accidents, reduced service life and safety, and longer time for feeding materials, so as to avoid Accidents, rapid chemical accidents, and the effect of reducing heat loss
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[0023] The present invention can be better understood from the following examples.
[0024] Such as figure 1 As shown, the Czochralski single crystal charging process of the present invention performs regional configuration of silicon materials of different shapes, and the specific steps are as follows:
[0025] First, fill small material at the bottom of the quartz crucible to form a small material bottom layer 1 with a thickness of 80-120 mm.
[0026] Subsequently, on the top of the small material bottom layer 1, the large material is stacked successively, and when each layer of large material is stacked, the gap of the large material is filled with the small material to form the composite layer 2 of the large and small material. When stacking the composite layer 2 of large and small materials, pay attention to the contact between the periphery of the composite layer 2 of large and small materials and the inner wall of the crucible, and use large materials to be stacked clo...
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