Double-waveguide/multi-waveguide channel structure working in W wave band and TR module

Abstract

The invention discloses a double-waveguide / multi-waveguide channel structure working in a W wave band and a TR module. A waveguide gap between adjacent output waveguide channels protrudes in the normal direction perpendicular to the waveguide gap in a bending mode to form a protruding structure, a protruding decoupling strand is covered with a wave absorbing material, the double-waveguide channel structure is obtained, and the multi-waveguide channel structure is obtained through similar expansion. The multi-waveguide channel TR module is provided with a module main cavity, a first side and a second side with openings are designed on opposite surfaces of the module main cavity, the first side is sealed by an upper airtight cover plate, a waveguide cover plate and a radio frequency power supply plate are mounted in the first side, a circulator and a power supply sub-plate are mounted in the second side, the circulator is sealed by a lower airtight cover plate, a power supply sub-plate cover plate covers the outer side of the power supply sub-plate, and a power supply insulator passes through the module main cavity to connect the power supply sub-plate and the radio frequency power supply plate. According to the invention, mutual interference between channels can be effectively avoided under the W wave band, and effective airtightness of the module can be realized.

Description

Technical field [0001] The present invention relates to millimeter wave communications and radar, and in particular a disturbance in the working channels W between the anti-dual band waveguide channel structure in one of the working channels W between the anti-multi-band interference wave guide channel structure, and one of the working in the W-band waveguide channels hermetically sealed multi-TR module. Background technique [0002] W-band electronic information device because of its small size, light weight, high resolution and wide bandwidth and other inherent advantages, both in military and civil field has great potential. W-band technology can be used in communications, millimeter-wave radar, the airport object detection, millimeter wave security and other fields in recent years has attracted huge investment in research. Wherein, TR module as an important component of the W-band electronic system, at the rear end of the antenna, from the main amplified signal attenuation an...

AI Technical Summary

Problems solved by technology

Among them, due to the high frequency of the W-band, the waveguide is generally used as the interface form of the millimeter wave signal, and the waveguide is a conventional interface form, usually in the form of an opening, which has no protective effect on the internal bare chip and other devices.

At present, most of the existing airtight solutions for waveguide ports solve the airtight problem of a single waveguide channel.

However, it is very difficult to realize the airtightness of the multi-channel waveguide interface, especially for the highly integrated TR module

The second difficulty is that since the waveguide output interfaces of the multi-channel TR module are often arranged in parallel, its internal structure is complex; limited by the processing means, it cannot be processed and formed in one piece, and it must be divided structurally, and then screwed to lock

However, there are two problems with this structure: one is that due to the use of this structure, there must be a waveguide gap between the waveguide channels, and the waveguide gap will cause mutual interference between the channels, so how to solve the mutual interference between the waveguide channels is a problem. Second, the structure does not have airtight characteristics, so how to achieve airtightness for the divided waveguide structure is also a major difficulty

The third difficulty is that TR modules, especially high-power TR modules, have many internal devices, involving circulators, microstrip lines, millimeter-wave chips, digital chips, power chips, connectors, PCB boards, etc. devices, and the number is large, so how to achieve a hermetic package while ensuring a certain degree of integration is very difficult

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