Liquid polishing machine capable of accurately controlling removal amount and polishing process

Abstract

The invention discloses a liquid polishing machine capable of accurately controlling the removal amount and a polishing process, and relates to the technical field of workpiece polishing. The liquid polishing machine comprises a polishing box, and further comprises a roughometer and two nozzles, wherein the inner wall of the polishing box is fixedly connected with a filter screen; the side face of the polishing box is provided with a control box; the bottom face of the polishing box is fixedly connected with a liquid storage box; a feeding port is formed in the top face of the polishing box; a fixing part used for fixing a workpiece is arranged in the polishing box; and the liquid polishing machine further comprises a displacement part which drives the two nozzles to displace, so that the workpiece can be more comprehensively polished. Through mutual cooperation between the structures, the liquid polishing machine and the polishing process have the effects of comprehensively and uniformly scouring and polishing the mechanical energy of the workpiece, being good in polishing effect and being capable of controlling the polishing removal amount of the workpiece, and solve the problems that the removal amount of the workpiece cannot be controlled by a traditional device, the spatial position of the workpiece needs to be manually adjusted during polishing, and time is wasted.

Description

technical field [0001] The invention relates to the technical field of workpiece polishing, in particular to a liquid polishing machine capable of precisely controlling the removal amount and a polishing process. Background technique [0002] Polishing machines, also known as grinding machines, are often used for mechanical grinding, polishing and waxing. There are two types of power sources: pneumatic and electric. [0003] When the traditional polishing machine is in use, the scope of polishing the workpiece is small. In order to perform a comprehensive and uniform polishing of the workpiece as a whole, it is often necessary to manually adjust the spatial position of the workpiece. At this time, more operating time will be wasted, and The traditional device cannot control the removal amount of the workpiece, cannot meet the precise polishing requirements, and is inconvenient to use. Contents of the invention [0004] The purpose of the present invention is to provide a ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a liquid polishing machine and a polishing process that can accurately control the amount of removal. Traditional devices cannot control the removal amount of the workpiece, and often need to manually adjust the spatial position of the workpiece during polishing, which is a waste of time

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