Laser device chip positioning and clamping mechanism

Abstract

The invention relates to the technical field of chip manufacturing, and provides a laser device chip positioning and clamping mechanism, which comprises a chip positioning and clamping mechanism body, wherein the chip positioning and clamping mechanism body comprises a main clamping frame, a fixed sliding rod is movably connected to the center of the inner side of the main clamping frame, and curved clamping rods are movably connected to the left side and the right side of the fixed sliding rod. According to the laser device chip positioning and clamping mechanism, the curved matching frame drives the extrusion air bag to extrude towards the center, at the moment, chip machining is in the later stage, the surface of the chip has many processing residues, the extrusion air bag extrudes the telescopic rods on the two sides of the extrusion frame in a linkage mode to move towards the inner side, the telescopic rods extrude the pushing frame to move towards the inner side, and the pushing frame pushes the processing material on the surface of the chip to push the processing material out of the normal processing range of the chip, so that the residual material in the previous processing is prevented from being left on the surface of the chip, the quality of a later product is improved, and the later clamping is not influenced.

Description

technical field [0001] The invention relates to the technical field of chip production, in particular to a laser chip positioning and clamping mechanism. Background technique [0002] A chip is a kind of integrated circuit. With the development of the times, integrated circuits have become ubiquitous. Computers, mobile phones and other digital appliances have become an indispensable part of the modern social structure. During processing, it is necessary to use a positioning and clamping mechanism to fix it, so as to improve the production efficiency of chips. [0003] When the current laser chip positioning and clamping mechanism fixes the chip, there are many transistors inside the chip, and its material is relatively fragile and easily deformed by external force. After the center is fixed, both sides of the chip are more likely to be stressed, and the center There will be concave folds, and the inside of the chip will be damaged. It is difficult for the conventional fixed...

AI Technical Summary

Problems solved by technology

[0003] When the current laser chip positioning and clamping mechanism fixes the chip, there are many transistors inside the chip, and its material is relatively fragile and easily deformed by external force. After the center is fixed, both sides of the chip are more likely to be stressed, and the center There will be concave folds, and the inside of the chip will be damaged. It is difficult for the conventional fixed clamping mechanism to quickly cooperate with the equipment for processing, and the production efficiency of the chip is slow. When the chip is processed in multiple places, the remaining materials from the previous processing will remain. On its surface, it affects the quality of later products, and the later clamping will be adversely affected at the same time. Therefore, we propose a laser chip positioning and clamping mechanism

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