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Circuit board heat dissipation system

A heat dissipation system and circuit board technology, which is applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve the problems of circuit board deformation, different heat generation, uneven temperature of the circuit board, etc. Uniform, speed up heat dissipation efficiency, avoid deformation effect

Active Publication Date: 2021-10-01
CHONGQING IND POLYTECHNIC COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the heat generated by the electronic devices on the same circuit board is different, resulting in uneven temperature in each area of ​​the circuit board, and the circuit board has the characteristics of thermal expansion and contraction, when the circuit board is affected by temperature, the temperature rises When the temperature of each area of ​​the circuit board is different, it will cause the difference in expansion and contraction of each area of ​​the circuit board, resulting in deformation of the circuit board

Method used

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  • Circuit board heat dissipation system
  • Circuit board heat dissipation system
  • Circuit board heat dissipation system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1 is basically as attached figure 1 And attached Figure 4 Shown:

[0044]A circuit board cooling system includes a temperature detection module, a cooling module and a baffle module. The temperature detection module is used to detect the temperature data of each area of ​​the circuit board; the cooling module includes an air supply module and an air supply control module: the air supply module includes several air supply ducts 2 arranged laterally on the side of the circuit board, The air supply module in this embodiment is three air supply ducts 2 arranged laterally on the side of the circuit board; the air supply control module is used to control the opening and closing of the air supply duct 2; the baffle module includes a baffle control Module and several movable baffles 1: the movable baffle 1 is arranged above the circuit board and corresponds to each area of ​​the circuit board. In this embodiment, the circuit board is divided into 6 regions, and 6 ...

Embodiment 2

[0050] Embodiment 2 is basically as attached figure 2 Shown:

[0051] The basic principle of embodiment 2 is the same as that of embodiment 1, the difference being that the height generation module in embodiment 2 also includes a temperature difference calculation module and a temperature difference comparison module.

[0052] The temperature difference calculation module is used to calculate the temperature difference between each area of ​​the circuit board and the area with the lowest temperature, and generate a calculation result;

[0053] The temperature difference comparison module is used to compare the calculation result with the temperature difference threshold and generate a comparison result;

[0054] The lifting height generation module is used to generate the lifting height of the movable baffle 1 corresponding to each area of ​​the circuit board according to the analysis result of the temperature data analysis module and the comparison result of the temperature...

Embodiment 3

[0059] Embodiment 3 is basically as attached image 3 Shown:

[0060] The basic principle of embodiment 3 is the same as that of embodiment 1, and the difference is that the cooling module in embodiment 3 also includes a wind speed control module, which is used to control the air supply wind speed of the air supply duct 2 according to the temperature data of each area of ​​the circuit board . In this embodiment, the initial air supply velocity of the air supply duct 2 is at the first gear, and when the number of areas whose temperature data is higher than the high temperature threshold exceeds one-half of the total area quantity, the air supply velocity of all the air supply ducts 2 will Adjust to the second gear. In other embodiments of the present application, when the temperature data in the area of ​​the circuit board exceeds the high temperature threshold, the air supply direction can be adjusted to the air supply speed of the air supply duct 2 in the area. It is the se...

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Abstract

The invention relates to the technical field of circuit board heat dissipation, in particular to a circuit board heat dissipation system which comprises a temperature detection module, a cooling module and a baffle module, wherein the temperature detection module is used for detecting temperature data of all areas of a circuit board; the cooling module comprises an air supply module and an air supply control module, and the air supply module comprises a plurality of air supply pipelines which are transversely arranged on the side surface of the circuit board; the air supply control module is used for controlling opening and closing of an air supply pipeline; the baffle module comprises a baffle control module and a plurality of movable baffles, and the movable baffles are arranged above the circuit board and correspond to all areas of the circuit board; the baffle control module is used for controlling the lifting of the movable baffles according to the temperature data of each area of the circuit board; and after the movable baffle descends, a panel of the movable baffle is opposite to the air supply outlet of the air supply pipeline. According to the scheme, heat dissipation treatment can be performed on the circuit board in the working process of the electronic equipment, and the heat dissipation efficiency of the circuit board in the area can be controlled according to the temperature of each area of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board heat dissipation, in particular to a circuit board heat dissipation system. Background technique [0002] When electronic equipment is working, it continuously generates heat, which causes the temperature inside the equipment to rise. Therefore, the circuit power consumption device is the direct cause of the temperature rise of the internal circuit board of the electronic equipment. During the working process of electronic equipment, as the power consumption changes, the heat generation of each electronic device in the circuit board will also change continuously. If the heat generated by the circuit board is not dissipated in time, the electronic equipment will continue to heat up. , resulting in overheating and failure of electronic devices. Therefore, it is very important to heat the circuit board in time during the use of electronic equipment, especially for the circuit boards of some hi...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20209H05K7/20136Y02D10/00
Inventor 倪元敏
Owner CHONGQING IND POLYTECHNIC COLLEGE
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