Manipulator and method for acquiring and transmitting wafers thereof

A technology of manipulators and wafers, applied in the direction of manipulators, program-controlled manipulators, conveyor objects, etc., can solve the problems of time-consuming and labor-intensive manipulator operation, and achieve the effect of improving grasping efficiency

Inactive Publication Date: 2021-10-08
G H S ADVANCED EQUIP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a manipulator and its method for obtaining and transporting wafers, which has the advantages of stable transportation and solves a series of problems such as time-consuming and labor-intensive operation of traditional manipulators.

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  • Manipulator and method for acquiring and transmitting wafers thereof
  • Manipulator and method for acquiring and transmitting wafers thereof
  • Manipulator and method for acquiring and transmitting wafers thereof

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] As described in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, this application proposes a manipulator and its method for acquiring and transporting wafers

[0035] In a typical implementation of the present application, such as Figure 1-7As shown, a manipulator includes a manipulator body and a transport channel 14. The manipulator body includes a base 1, a rotating assembly 2, a ver...

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Abstract

The invention relates to the field of semiconductor equipment, and discloses a manipulator and a method for acquiring and transmitting wafers thereof. When the wafers are transported in a transport channel, the wafers are pushed to a set position by arranging a horizontal guide rail, a first infrared transmitting end and the like, so that the wafers can be directly taken out by a mechanical claw subsequently, and therefore, real-time detection of the relative position of the wafers during transmission in the transmission channel is avoided, and meanwhile, the problems that time and labor are wasted and the transmission efficiency is reduced by adjusting the position of a mechanical claw to adapt to grabbing of the wafers with different deviation degrees, and the wafer position deviation is caused if a clamping assembly fails in the wafer transfer process of the mechanical claw are avoided. By arranging the second infrared transmitting end and the like, the relative position of the wafer is detected and adjusted in real time in the process that the wafer is operated by the mechanical claw, and a situation that the operation of the mechanical claw is stopped after accidental deviation occurs, so that the time is delayed, and the operation rate of the mechanical claw is reduced is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a manipulator and a method for acquiring and transporting wafers thereof. Background technique [0002] Yield rate is a key indicator pursued by fabs, which directly affects production efficiency and company benefits. In the process of wafer manufacturing, the yield rate is determined by many factors. In addition to the hardware factors such as the process chamber and process conditions, the offset and slide of the wafer during the transmission process are also crucial to it. Impact. Offset refers to the deviation of the wafer from the center position in the reaction chamber, and the slide refers to the change of the relative position of the wafer due to improper transmission speed or insufficient friction between the wafer and the manipulator during the transmission process. Offset and slippage can easily cause differences in the process response and expectations, and at...

Claims

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Application Information

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IPC IPC(8): B25J9/00H01L21/677
CPCB25J9/00H01L21/67742
Inventor 尹明清
Owner G H S ADVANCED EQUIP TECH CO LTD
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