Nitrogen protection device for gold tin sintering and constant temperature eutectic machine with the same

Abstract

The invention provides a gold-tin sintered nitrogen protection device and a constant temperature type eutectic machine with the same. The gold-tin sintered nitrogen protection device includes a protection box, two gas pipes, two dispersion shells and a negative film. The middle part of the box body of the protection box is provided with a through opening that penetrates up and down, and an air inlet is provided on each of the side walls on both sides of the box body. The air pipes are respectively communicated with an air inlet. Two dispersing shells are located in the box and are adjacent to one of the air inlets respectively. The dispersion shell is provided with a number of air holes. The bottom sheet is arranged outside the box body, and the bottom sheet has an operation port which is directly opposite to the through port. When gold-tin is sintered, the through port can pass the chip and is placed above the tube shell, and the two streams of nitrogen gas in the box meet from the tube shell, and provide nitrogen protection for the tube shell and the chip. The pores on the dispersing shell can make the nitrogen dispersed evenly and form a steady nitrogen flow. Since the bottom of the box body is provided with a negative film and the two streams of nitrogen gas in the box body meet from the tube shell, the gold-tin sintering can provide nitrogen protection to the tube shell and the chip.

Description

technical field [0001] The invention belongs to the technical field of microelectronic assembly, and more particularly relates to a nitrogen protection device for gold-tin sintering and a constant temperature eutectic machine with the same. Background technique [0002] In microelectronics assembly technology, gold-tin eutectic technology is often used to assemble electronic devices due to the good performance, high joint strength and good wettability of gold-tin sintering. However, when gold-tin sintering is used, if it is carried out under the condition of no atmosphere protection, the solder is easily oxidized, resulting in the problem of solder accumulation and the phenomenon of solder delamination, which seriously affects the soldering quality. [0003] The production efficiency of the existing pulsed eutectic machine is relatively low. Compared with the pulse type eutectic machine, the production efficiency of the constant temperature type eutectic machine is about 3 ...

AI Technical Summary

Problems solved by technology

However, because the heating part of the constant temperature eutectic machine is a non-airtight structure, that is, the oxygen concentration in the heating part is relatively high, so it is easy to cause serious oxidation of the solder during the heating process.

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