Photo-thermal dual-curable adhesive and preparation method thereof

A dual-curing and adhesive technology, applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve problems such as poor curing, and achieve the effect of high strength and high temperature and high humidity reliability

Active Publication Date: 2021-10-12
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of poor curing of the UV-curable adhesive in the shadow part in the prior art, the present invention provides a photothermal dual-curable adhesive and a preparation method thereof, so that the UV-curable adhesive can meet the requirement that the shadow part can be cured. need

Method used

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  • Photo-thermal dual-curable adhesive and preparation method thereof
  • Photo-thermal dual-curable adhesive and preparation method thereof
  • Photo-thermal dual-curable adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Accurately weigh the following raw materials, 30g of modified resin with both acrylate groups and isocyanate groups; four-functional special epoxy resin BATG produced by Japan Showa Denko, 30g; THFA, 30g; acrylate monomer of end-blocked isocyanate Japan Showa Denko's AOI-BP, 5g; free radical photoinitiator 184, 3g; special mercaptan Japanese SC organic PEPT, 12g; latent amine curing agent PN-40 7g; add the above components in turn to double planetary power In the mixing mixer, evacuate to a vacuum degree of -0.08MPa, stir at 500 rpm for 2 hours, stir evenly, let it air naturally to room temperature, and obtain a UV-curable adhesive, which can be sealed and packaged.

Embodiment 2

[0032] Accurately weigh the following raw materials, 20g of modified resin with both acrylate groups and isocyanate groups; four-functional special epoxy resin BATG produced by Japan Showa Denko, 20g; IBOA, 30g; acrylate monomer of end-blocked isocyanate Japan Showa Denko's AOI-BP, 10g; free radical photoinitiator TPO, 1g; special mercaptan Japanese SC organic PEPT, 5g; latent amine curing agent PN-50 3g; add the above components in turn to double planetary power In the mixing mixer, evacuate to a vacuum degree of -0.05MPa, stir at 750 rpm for 1 hour, stir evenly, let it air naturally to room temperature, and obtain a UV-curable adhesive, which can be sealed and packaged.

Embodiment 3

[0034] Accurately weigh the following raw materials, 40g of modified resin with both acrylate groups and isocyanate groups; four-functional special epoxy resin BATG produced by Japan Showa Denko, 10g; LA, 10g; end-blocked isocyanate Acrylate monomer Japan Showa Denko's AOI-BP, 3g; free radical photoinitiator 184, 5g; special mercaptan Japanese SC organic PEPT, 17g; latent amine curing agent FXR-1030 7g; add the above components in turn to double planetary power In the mixing mixer, evacuate to a vacuum degree of -0.06MPa, stir at 700 rpm for 1.5 hours, stir evenly, let it air naturally to room temperature, and obtain a UV-curable adhesive, which can be sealed and packaged.

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Abstract

The invention relates to a photo-thermal dual-curable adhesive. The adhesive of the invention is prepared from the following raw materials in percentage by weight: 15-40% of modified resin with an acrylate group and an isocyanate group on one molecule, 10-30% of four-functionality special epoxy resin, 10-30% of an acrylate monomer, 3-10% of an acrylate monomer of blocked isocyanate, 1-5% of a free radical photoinitiator, 5-17% of special thiol and 3-10% of a latent amine curing agent. The photo-thermal dual-curable adhesive prepared by the invention has better storage stability, high bonding strength, better high-temperature and high-humidity resistance and wide application range.

Description

technical field [0001] The invention belongs to the field of photocurable materials, and relates to a photothermal dual-curable adhesive and a preparation method thereof, which are suitable for application in the electronic field. Background technique [0002] Light-curing adhesives have been widely studied due to their outstanding advantages such as fast curing speed, environmental friendliness, low energy consumption, and no solvent volatilization, and they are rapidly promoted in various industries. However, light-curing adhesives also have their own limitations. Translucent materials or component shading parts absorb, block and reflect ultraviolet light. Photoinitiators often have low initiation efficiency, and the adhesive is not easy to cure completely, which greatly reduces the mechanical properties of the adhesive layer. . [0003] In order to solve the disadvantage that the shadow part cannot be cured during the photopolymerization process, researchers have develop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02
CPCC09J4/06
Inventor 潘光君王博姜贵琳陈田安王建斌谢海华
Owner YANTAI DARBOND TECH
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