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A microwave low reflection temperature control unit, superstructure and design method

A temperature-controlled, low-reflection technology, used in electrical components, antennas, etc., to solve problems such as high reflection and inability to effectively absorb microwaves, and achieve the effect of reducing thermal radiation differences, simple structure, and compatibility.

Active Publication Date: 2022-01-07
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Peltier refrigeration sheets are generally composed of cover plates, semiconductor grains, and flow guide circuits. These materials are either low-loss dielectric materials or high-reflection materials, which cannot effectively absorb microwaves.

Method used

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  • A microwave low reflection temperature control unit, superstructure and design method
  • A microwave low reflection temperature control unit, superstructure and design method
  • A microwave low reflection temperature control unit, superstructure and design method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] In this embodiment, the superstructure is designed according to the reflection characteristics of incident waves at 11-19 GHz (preset frequency range). The parameters of the basic unit are: px= 5.5 mm, py=6.875 mm, gx=3.0 mm, gy=4.36 mm, and the parameters of the semiconductor grain are a=1.05 mm, h=3.0 mm. px:py=4:5, the ratio satisfies a simple integer ratio, then the "0" coding unit can be composed of 5×4 ( M× Z ) basic units, the "1" coding unit is obtained by rotating the "0" coding unit 90° along the z-axis, and the side length of the subunit 42 is p_c=27.5 mm. The arrangement of superstructure coding units is 010101... / 101010....

[0069] Figure 4 It is the simulation result of the polarization transformation of the basic unit in the first embodiment of the disclosure;

[0070] refer to Figure 4 , the conversion efficiency of the designed basic unit is above 90% in the frequency range of 12.2-18.0 GHz, which indicates that the designed Peltier temperature ...

Embodiment 2

[0078] The structure and size of the basic unit, 1" coding unit, and "0" coding unit in the second embodiment are the same as those in the first embodiment, the difference is that the arrangement of the superstructure coding units is 010101... / 010101..., that is, according to the periodic bar In this case, the coding units are still arranged in the grid-like structure.

[0079] Figure 8 This is the simulation result of the vertical reflectivity of the superstructure in which the "0" and "1" coding units are arranged in the manner of 010101... / 010101... in the second embodiment of the present invention.

[0080] The "0" and "1" coding units are arranged according to 010101... / 010101... to form a superstructure with a side length of 220 mm. The superstructure has a beam-splitting effect on incident electromagnetic waves, and can split vertically incident electromagnetic waves into two directions perpendicular to the periodic bar, that is, the azimuth angles are 0° and 180°. C...

Embodiment 3

[0082] In this embodiment, the superstructure is designed according to the reflection characteristics of the incident wave at 12-20 GHz (preset frequency range). The parameters of the basic unit are: px= 4.8 mm, py=6.4 mm, gx=2.8 mm, gy=4 mm, and the parameters of the semiconductor grain are a=1.05mm, h=3.0 mm. px:py=3:4, the ratio is a simple integer ratio, then the "0" coding unit can be composed of 4×3 ( M×Z ) basic units, the "1" coding unit is obtained by rotating the "0" coding unit 90° along the z-axis, and the side length of the coding unit is p_c=19.2mm.

[0083] Figure 9 It is the simulation result of the polarization transformation of the basic unit in the third embodiment of the disclosure;

[0084] refer to Figure 9 , the conversion efficiency of the designed basic unit is above 90% in the frequency range of 12.68~19.77 GHz, which indicates that the designed Peltier temperature control unit has good polarization conversion efficiency in the simulation frequen...

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Abstract

A microwave low-reflection temperature control unit, superstructure and design method. The temperature control unit includes: a top layer; Two-layer body; the first layer body and the second layer body are provided with conduction via holes, so that the conduction circuit extends to the side of the bottom layer facing away from the top layer; the metal reflective layer is provided with through holes, so that the conduction circuit is insulated from the metal reflective layer Isolation; at least one semiconductor element is disposed between the top layer and the bottom layer, and is connected to the conduction circuit to provide a heat conduction path between the top layer and the bottom layer. Through the specific arrangement of the temperature control units in the superstructure, the phase of the reflected electromagnetic wave can be effectively modulated, thereby realizing the dual functions of surface temperature adjustment and low reflection of microwaves, and the superstructure has mature manufacturing technology, low cost, and It is easy to use and effectively solves the problem of infrared and microwave compatibility.

Description

technical field [0001] The invention relates to the technical field of electromagnetic wave phase regulation, in particular to a Peltier temperature control unit and a superstructure with adjustable surface temperature and low microwave reflection and a design method thereof. Background technique [0002] Among the existing detection methods, the detection methods represented by microwave and infrared occupy the dominant position. Therefore, the development of infrared-microwave compatible electromagnetic materials has important practical significance. [0003] The technical requirements of infrared-microwave compatible electromagnetic materials are: to minimize the microwave reflection signal of the object, and at the same time reduce the thermal radiation difference between the object and the background. At present, the main technical way to achieve infrared and microwave compatibility is to superimpose and compound infrared low emissivity materials and microwave absorbing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00
CPCH01Q15/0086H01Q15/0026H01Q15/002H01Q15/0046
Inventor 罗先刚袁黎明黄成蒲明博马晓亮计琛廖建明
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI