Method for eliminating residual stress of aluminum alloy component formed by selective laser melting

A technology for selective laser melting and aluminum alloy components, applied in the field of material processing, can solve the problems of reduced material strength and inability to play a bearing role of structural components, and achieve the effect of ensuring mechanical properties

Pending Publication Date: 2021-10-22
SHANGHAI JIAO TONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first category is to release the residual stress through plastic deformation, such as mechanical stretching, cold compression, vibration deformation, surface shot peening, rolling, etc. This method is not suitable for parts with complex structures formed by SLM; the second category Residual stress is reduced by high-temperature heat treatment, such as preheating the substrate (200°C), stress-relief annealing (300°C), etc. These methods can reduce residual stress to a certain extent, but after high-temperature heat treatment, SLM formed aluminum alloy interior The fine structure of the material is completely destroyed, and the strength of the material will be significantly reduced, making it unable to play the bearing role of the structural parts

Method used

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  • Method for eliminating residual stress of aluminum alloy component formed by selective laser melting

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Embodiment 1

[0026] This embodiment provides a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting. In the method, a schematic diagram of the temperature of the component changing with time figure 1 shown; the specific steps are:

[0027] (S1) AlSi10Mg alloy components formed by selective laser melting are immersed in liquid nitrogen for 30 min;

[0028] (S2) the component is quickly transferred to 180 ℃ of dimethicone oil, so that it is rapidly heated up, and kept for 30min;

[0029] (S3) The take-out member is cooled to room temperature in the air.

[0030] Wherein, the transfer time in step S2 is 3s, and the average heating rate in this process is 52°C / min.

[0031] X-ray stress analyzer (equipment model: iXRD) was used to test the residual stress of the AlSi10Mg alloy components formed by selective laser melting before and after treatment. The stress is reduced to 36±4MPa.

Embodiment 2

[0033] The present embodiment provides a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting. The specific steps are:

[0034] (S1) AlSi10Mg alloy components formed by selective laser melting are immersed in liquid nitrogen for 30 min;

[0035] (S2) the component is quickly transferred to 150 ℃ of dimethyl silicone oil, so that it is rapidly heated up, and kept for 30min;

[0036] (S3) take out the member and cool it to room temperature in air;

[0037] (S4) Repeat operations S1-S3 once.

[0038] Wherein, the transfer time in step S2 is 3s, and the average heating rate in this process is 38°C / min.

[0039] X-ray stress analyzer (equipment model: iXRD) was used to test the residual stress of the AlSi10Mg alloy components formed by selective laser melting before and after treatment. The stress is reduced to 10±3MPa.

Embodiment 3

[0041] The present embodiment provides a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting. The specific steps are:

[0042] (S1) AlSi10Mg alloy components formed by selective laser melting are immersed in liquid nitrogen for 30 min;

[0043] (S2) quickly transfer this component to 150 ℃ of dimethyl silicone oil, make it heat up rapidly, and keep warm for 10min;

[0044] (S3) take out the member and cool it to room temperature in air;

[0045] (S4) Repeat operations S1-S3 twice.

[0046] Wherein, the transfer time in step S2 is 3s, and the average heating rate in this process is 36°C / min.

[0047] X-ray stress analyzer (equipment model: iXRD) was used to test the residual stress of the AlSi10Mg alloy components formed by selective laser melting before and after treatment. The stress is reduced to 26±4MPa.

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Abstract

The invention relates to a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting. The method specifically comprises the following steps of (S1), immersing the aluminum alloy component formed by selective laser melting into a low-temperature medium, and fully cooling the aluminum alloy component; (S2), rapidly transferring the component into a high-temperature medium, rapidly increasing the temperature of the component, and carrying out heat preservation for a period of time; (S3), taking out the component and cooling to the room temperature in air; and (S4), cyclically repeating the operations from S1 to S3. The method is suitable for the aluminum alloy component which is formed by selective laser melting and has a complex shape, the treated component has low residual stress, and the dimensional stability of the component can be improved.

Description

technical field [0001] The invention belongs to the technical field of material processing, and relates to a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting. Background technique [0002] With the development of modern science and technology, the high-end equipment field represented by large aircraft such as C919 has an increasingly urgent demand for large, precise and complex metal components, and the performance, reliability and preparation technology of materials are increasingly proposed. demanding requirements. Additive manufacturing of aluminum alloys can solve the technical problems of rapid manufacturing of complex shapes and high-performance metal components. Among them, selective laser melting (SLM) forming aluminum alloys is the most mature and widely used, and is becoming a key technology in the field of aerospace manufacturing. It is an effective way to solve the problem and has broad application prospects...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F10/64B33Y40/20C22F1/04
CPCB22F10/64B33Y40/20C22F1/04Y02P10/25
Inventor 王浩伟肖亚开吴一廉清王洪泽陈哲汪明亮
Owner SHANGHAI JIAO TONG UNIV
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